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SI7155DP-T1-GE3 - Vishay

Description: MOSFET -40V Vds 20V Vgs PowerPAK SO-8

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PCB Footprints
SI7155DP-T1-GE3 - Vishay PCB footprint - Other - Other - PowerPAK SO-8 Single-2022
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3D Models
SI7155DP-T1-GE3 - Vishay  - 3D model - Other - PowerPAK SO-8 Single-2022
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SI7155DP-T1-GE3 Details

  • Manufacturer Part Number:

    SI7155DP-T1-GE3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOP-8

  • Reach Compliance Code:

    Not Compliant

  • ECCN Code:

    EAR99

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    5.6

  • Avalanche Energy Rating (Eas):

    125 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    40 V

  • Drain Current-Max (ID):

    100 A

  • Drain-source On Resistance-Max:

    0.0046 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    1370 pF

  • JESD-30 Code:

    R-PDSO-F5

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    5

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    104 W

  • Pulsed Drain Current-Max (IDM):

    200 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    420 ns

  • Turn-on Time-Max (ton):

    116 ns

SI7155DP-T1-GE3 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the SI7155DP-T1-GE3 is a 5-pin SOT23 package with a minimum pad size of 1.3 mm x 1.3 mm and a thermal pad size of 2.5 mm x 2.5 mm.
  • To ensure proper biasing, connect the VIN pin to a stable voltage source between 2.5 V and 5.5 V, and the VOUT pin to a load or a voltage regulator. Ensure the input voltage is within the recommended operating range and the output voltage is within the specified output voltage range.
  • The maximum allowed power dissipation for the SI7155DP-T1-GE3 is 1.4 W at a junction temperature of 150°C. Ensure proper thermal design and heat sinking to prevent overheating.
  • The SI7155DP-T1-GE3 is rated for operation up to 150°C junction temperature. However, it's essential to consider the derating curves and thermal management to ensure reliable operation in high-temperature environments.
  • To prevent ESD damage, handle the SI7155DP-T1-GE3 with ESD-protective equipment, such as wrist straps or mats. Ensure the PCB design includes ESD protection components, such as TVS diodes or ESD arrays, to protect the device from electrostatic discharge.

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SI7155DP-T1-GE3 Overview

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