HALOGEN FREE AND ROHS COMPLIANT, LEADLESS, POWERPAK, SOP-8
ECCN Code:
EAR99
Manufacturer:
Vishay Intertechnologies
YTEOL:
0
Avalanche Energy Rating (Eas):
125 mJ
Case Connection:
DRAIN
Configuration:
SINGLE WITH BUILT-IN DIODE
DS Breakdown Voltage-Min:
60 V
Drain Current-Max (ID):
23.5 A
Drain-source On Resistance-Max:
0.00625 Ω
FET Technology:
METAL-OXIDE SEMICONDUCTOR
JESD-30 Code:
R-XDSO-C5
Moisture Sensitivity Level:
1
Number of Elements:
1
Number of Terminals:
5
Operating Mode:
ENHANCEMENT MODE
Operating Temperature-Max:
150 °C
Package Body Material:
UNSPECIFIED
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE
Polarity/Channel Type:
N-CHANNEL
Power Dissipation-Max (Abs):
104 W
Pulsed Drain Current-Max (IDM):
80 A
Qualification Status:
Not Qualified
Surface Mount:
YES
Terminal Finish:
PURE MATTE TIN
Terminal Form:
C BEND
Terminal Position:
DUAL
Transistor Application:
SWITCHING
Transistor Element Material:
SILICON
SI7164DP-T1-GE3 Frequently Asked Questions (FAQs)
A good PCB layout for the SI7164DP-T1-GE3 should include a solid ground plane, wide copper traces for power and ground, and a thermal relief pattern under the device to facilitate heat dissipation. A minimum of 2 oz copper thickness is recommended.
To ensure reliable operation in high-temperature environments, ensure proper heat sinking, use a thermally conductive interface material, and follow the recommended PCB layout guidelines. Additionally, consider derating the device's power handling capabilities according to the temperature derating curve provided in the datasheet.
The SI7164DP-T1-GE3 is a sensitive semiconductor device and requires proper ESD protection during handling and assembly. Use an ESD wrist strap or mat, and follow standard ESD handling procedures to prevent damage. The device is also sensitive to moisture, so ensure proper storage and handling in a dry environment.
The SI7164DP-T1-GE3 is a commercial-grade device, but it can be used in high-reliability or aerospace applications with proper qualification and testing. Consult with Vishay Intertechnologies for specific requirements and guidelines for these applications.
Follow the recommended soldering and rework conditions outlined in the datasheet, including peak temperatures, soldering times, and rework techniques. Ensure that the device is not exposed to excessive temperatures or thermal shocks during the soldering process.
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SI7164DP-T1-GE3 Overview
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