HALOGEN FREE AND ROHS COMPLIANT, LEADLESS, 1212-8, POWERPAK-8
Country Of Origin:
Germany
ECCN Code:
EAR99
Factory Lead Time:
19 Weeks
Manufacturer:
Vishay Intertechnologies
YTEOL:
5
Avalanche Energy Rating (Eas):
5 mJ
Case Connection:
DRAIN
Configuration:
SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE
DS Breakdown Voltage-Min:
40 V
Drain Current-Max (ID):
6.5 A
Drain-source On Resistance-Max:
0.032 Ω
FET Technology:
METAL-OXIDE SEMICONDUCTOR
JESD-30 Code:
S-XDSO-C6
JESD-609 Code:
e3
Moisture Sensitivity Level:
1
Number of Elements:
2
Number of Terminals:
6
Operating Mode:
ENHANCEMENT MODE
Operating Temperature-Max:
150 °C
Package Body Material:
UNSPECIFIED
Package Shape:
SQUARE
Package Style:
SMALL OUTLINE
Peak Reflow Temperature (Cel):
260
Polarity/Channel Type:
N-CHANNEL
Power Dissipation-Max (Abs):
20.8 W
Pulsed Drain Current-Max (IDM):
20 A
Qualification Status:
Not Qualified
Surface Mount:
YES
Terminal Finish:
Matte Tin (Sn)
Terminal Form:
C BEND
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30
Transistor Application:
SWITCHING
Transistor Element Material:
SILICON
SI7216DN-T1-GE3 Frequently Asked Questions (FAQs)
A good PCB layout for the SI7216DN-T1-GE3 should include a solid ground plane, wide copper traces for power and ground, and a thermal relief pattern under the device to facilitate heat dissipation. A minimum of 2 oz copper thickness is recommended.
To ensure reliable operation in high-temperature environments, ensure proper heat sinking, use a thermally conductive interface material, and follow the recommended PCB layout guidelines. Additionally, consider derating the device's current handling capability according to the temperature derating curve provided in the datasheet.
The SI7216DN-T1-GE3 is a sensitive semiconductor device and requires proper ESD protection during handling and assembly. Use an ESD wrist strap or mat, and follow standard ESD handling procedures to prevent damage. The device is rated for human body model (HBM) ESD protection up to 2 kV.
Yes, the SI7216DN-T1-GE3 is qualified for automotive and high-reliability applications. It meets the requirements of AEC-Q101 and is manufactured in an IATF 16949 certified facility. However, additional testing and validation may be required for specific applications.
The SI7216DN-T1-GE3 is a lead-free device and should be soldered using a lead-free soldering process. The recommended soldering temperature is 260°C (500°F) for a maximum of 10 seconds. For rework, use a low-temperature soldering iron and a solder wick or vacuum desoldering tool to avoid damaging the device.
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SI7216DN-T1-GE3 Overview
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