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SI7252DP-T1-GE3 - Vishay

Description: VISHAY - SI7252DP-T1-GE3 - MOSFET, N-CH, 100V, 36.7A, SOIC-8

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PCB Footprints
SI7252DP-T1-GE3 - Vishay PCB footprint - Other - Other - PowerPAK-SO8_1
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SI7252DP-T1-GE3 - Vishay  - 3D model - Other - PowerPAK-SO8_1
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SI7252DP-T1-GE3 Details

  • Manufacturer Part Number:

    SI7252DP-T1-GE3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    SOP-8

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    29 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    3

  • Avalanche Energy Rating (Eas):

    20 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    100 V

  • Drain Current-Max (ID):

    36.7 A

  • Drain-source On Resistance-Max:

    0.017 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-C6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Pulsed Drain Current-Max (IDM):

    80 A

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

SI7252DP-T1-GE3 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the SI7252DP-T1-GE3 is a standard SO-8 package with a 1.27mm pitch. A recommended land pattern is available in the Vishay Intertechnologies application note AN81142.
  • To ensure proper biasing, connect the VCC pin to a stable 5V power supply, and the GND pin to a solid ground plane. Additionally, decouple the VCC pin with a 10nF ceramic capacitor to reduce noise and ensure stable operation.
  • The maximum allowed power dissipation for the SI7252DP-T1-GE3 is 1.4W. Ensure that the device is properly heat-sinked and the ambient temperature is within the recommended operating range to prevent overheating.
  • Yes, the SI7252DP-T1-GE3 is qualified for automotive and high-reliability applications. It meets the requirements of AEC-Q101 and is PPAP capable. However, ensure that you follow the recommended operating conditions and guidelines for your specific application.
  • To troubleshoot issues with the SI7252DP-T1-GE3, start by verifying the power supply and ground connections. Check for proper biasing, decoupling, and heat sinking. Use an oscilloscope to monitor the input and output signals, and consult the datasheet and application notes for guidance on troubleshooting common issues.

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SI7252DP-T1-GE3 Overview

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