The recommended PCB footprint for the SI7308DN-T1-E3 is a 5x5 mm QFN package with a 0.5 mm pitch. A detailed footprint recommendation can be found in the Vishay Intertechnologies application note AN81142.
To ensure proper soldering, follow the recommended soldering profile and guidelines outlined in the Vishay Intertechnologies application note AN81142. Additionally, use a solder with a melting point below 260°C to prevent damage to the device.
The SI7308DN-T1-E3 has an operating temperature range of -40°C to 125°C. However, it's essential to note that the device's performance and reliability may degrade at extreme temperatures.
Yes, the SI7308DN-T1-E3 is qualified for automotive and high-reliability applications. It meets the AEC-Q100 standard and is PPAP capable. However, it's essential to consult with Vishay Intertechnologies for specific requirements and documentation.
To prevent electrostatic discharge (ESD) damage, handle the SI7308DN-T1-E3 with ESD-protective equipment, such as wrist straps, mats, and bags. Follow standard ESD handling procedures, and ensure the device is stored in a protective package when not in use.
Trust Checks
This model has been provided by an expert contributor.
Expert Contribution
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
SI7308DN-T1-E3 Overview
Use the download button to access the SI7308DN-T1-E3 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like SI730,
or try a keyword search, such as Power Field-Effect Transistors
