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SI7308DN-T1-GE3 - Vishay

Description: Trans MOSFET N-CH 60V 5.4A 8-Pin PowerPAK 1212 T/R

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SI7308DN-T1-GE3 - Vishay - PCB symbol
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SI7308DN-T1-GE3 - Vishay PCB footprint - Other - Other - SI7308DN-T1-GE3-1
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SI7308DN-T1-GE3 Details

  • Manufacturer Part Number:

    SI7308DN-T1-GE3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    HALOGEN FREE AND ROHS COMPLIANT, 1212-8, POWERPAK-8

  • ECCN Code:

    EAR99

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    0

  • Avalanche Energy Rating (Eas):

    6.1 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    5.4 A

  • Drain-source On Resistance-Max:

    0.058 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    S-XDSO-C5

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    5

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    19.8 W

  • Pulsed Drain Current-Max (IDM):

    20 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

SI7308DN-T1-GE3 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the SI7308DN-T1-GE3 is a 5x5 mm QFN package with a 0.5 mm pitch. A detailed footprint recommendation can be found in the Vishay Intertechnologies application note AN10343.
  • To ensure proper soldering, follow the recommended soldering profile and guidelines outlined in the Vishay Intertechnologies application note AN10343. Additionally, use a solder with a melting point below 260°C to prevent damage to the device.
  • The SI7308DN-T1-GE3 has an operating temperature range of -40°C to 125°C. However, it's essential to note that the device's performance and reliability may degrade at extreme temperatures.
  • Yes, the SI7308DN-T1-GE3 is qualified for automotive and high-reliability applications. It meets the AEC-Q100 standard and is PPAP capable. However, it's essential to consult with Vishay Intertechnologies for specific requirements and documentation.
  • To prevent ESD damage, handle the SI7308DN-T1-GE3 with ESD-protective equipment, such as wrist straps, mats, and bags. Ensure that the device is stored in a conductive bag or tube when not in use.

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SI7308DN-T1-GE3 Overview

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