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SI7431DP-T1-E3 - Vishay

Description: MOSFET -200V Vds 20V Vgs PowerPAK SO-8 2.2A (Ta) 1.9W (Ta) Surface Mount

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SI7431DP-T1-E3 - Vishay - PCB symbol
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PCB Footprints
SI7431DP-T1-E3 - Vishay PCB footprint - Other - Other - PowerPAK® SO-8
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SI7431DP-T1-E3 - Vishay - 3D model - Other - PowerPAK® SO-8
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SI7431DP-T1-E3 Details

  • Manufacturer Part Number:

    SI7431DP-T1-E3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    ROHS COMPLIANT, LEADLESS, POWERPAK, SOP-8

  • Country Of Origin:

    Israel

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    68 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    6

  • Additional Feature:

    ULTRA-LOW RESISTANCE

  • Avalanche Energy Rating (Eas):

    45 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    200 V

  • Drain Current-Max (ID):

    2.2 A

  • Drain-source On Resistance-Max:

    0.174 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-XDSO-C5

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    5

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    5.4 W

  • Pulsed Drain Current-Max (IDM):

    30 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

SI7431DP-T1-E3 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the SI7431DP-T1-E3 is a standard SOT23-3L package with a 1.3mm x 1.3mm body size. A minimum pad size of 0.6mm x 0.6mm is recommended for reliable soldering.
  • To ensure proper biasing, connect the input pin (pin 1) to a voltage source between 1.65V and 5.5V, and the enable pin (pin 2) to a logic signal or a voltage source between 0V and 5.5V. The output pin (pin 3) should be connected to a load or a voltage divider, if necessary.
  • The SI7431DP-T1-E3 has an operating temperature range of -40°C to 125°C. However, it's recommended to operate the device within a temperature range of -20°C to 85°C for optimal performance and reliability.
  • The SI7431DP-T1-E3 is designed for low-frequency applications up to 100 kHz. While it may work at higher frequencies, its performance and reliability may degrade. For high-frequency applications, consider using a different device specifically designed for high-frequency operation.
  • To prevent electrostatic discharge (ESD) damage, handle the SI7431DP-T1-E3 with an ESD wrist strap or mat, and ensure the workspace is ESD-protected. Avoid touching the device's pins or handling it in a way that could generate static electricity.

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SI7431DP-T1-E3 Overview

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