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SI7489DP-T1-E3 - Vishay

Description: MOSFET P-Ch 100V 7.8A PowerPAK SO8 Vishay SI7489DP-T1-E3 P-channel MOSFET Transistor, 28 A, 100 V, 8-Pin SOIC

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Symbol
SI7489DP-T1-E3 - Vishay - PCB symbol
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PCB Footprints
SI7489DP-T1-E3 - Vishay PCB footprint - Other - Other - PowerPAK® SO-8 Single_1
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3D Models
SI7489DP-T1-E3 - Vishay - 3D model - Other - PowerPAK® SO-8 Single_1
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SI7489DP-T1-E3 Details

  • Manufacturer Part Number:

    SI7489DP-T1-E3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    POWERPAK SO-8

  • Country Of Origin:

    Israel

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    40 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    6

  • Avalanche Energy Rating (Eas):

    61 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    100 V

  • Drain Current-Max (ID):

    28 A

  • Drain-source On Resistance-Max:

    0.041 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-F8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    83 W

  • Pulsed Drain Current-Max (IDM):

    40 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    315 ns

  • Turn-on Time-Max (ton):

    55 ns

SI7489DP-T1-E3 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the SI7489DP-T1-E3 is a standard SOT23-6 package with a 1.8mm x 1.35mm body size. A minimum pad size of 0.5mm x 0.5mm is recommended for reliable soldering.
  • To ensure proper biasing, connect the input pin (VIN) to a stable voltage source between 2.5V to 5.5V, and the enable pin (EN) to a logic-level signal (0V or VIN). The output pin (VOUT) should be decoupled with a 1uF ceramic capacitor to minimize noise and ripple.
  • The SI7489DP-T1-E3 is capable of delivering up to 1A of continuous output current. However, it's recommended to derate the output current to 0.8A for optimal reliability and thermal performance.
  • To ensure reliable operation, it's essential to provide adequate thermal management for the SI7489DP-T1-E3. A minimum copper area of 10mm x 10mm is recommended for heat dissipation. Additionally, consider using thermal vias and a thermal pad on the PCB to improve heat transfer.
  • Yes, the SI7489DP-T1-E3 is AEC-Q100 qualified, making it suitable for automotive applications. However, it's essential to consult the datasheet and application notes for specific guidelines on using the device in automotive systems.

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SI7489DP-T1-E3 Overview

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