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SI7615DN-T1-GE3 - Vishay

Description: P-Channel 20 V 35A (Tc) 3.7W (Ta), 52W (Tc) Surface Mount PowerPAK® 1212-8

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SI7615DN-T1-GE3 - Vishay PCB footprint - Other - Other - SI7615DN-T1-GE3
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SI7615DN-T1-GE3 - Vishay  - 3D model - Other - SI7615DN-T1-GE3
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SI7615DN-T1-GE3 Details

  • Manufacturer Part Number:

    SI7615DN-T1-GE3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    5

  • Avalanche Energy Rating (Eas):

    20 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    20 V

  • Drain Current-Max (ID):

    22.6 A

  • Drain-source On Resistance-Max:

    0.0039 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    S-XDSO-C5

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    5

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    52 W

  • Pulsed Drain Current-Max (IDM):

    80 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

SI7615DN-T1-GE3 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the SI7615DN-T1-GE3 is a 5-pin SOT23 package with a minimum pad size of 0.8 mm x 0.8 mm and a thermal pad size of 2.5 mm x 2.5 mm.
  • To ensure proper soldering, use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the PCB pads. Use a soldering technique that minimizes thermal stress on the component.
  • The maximum operating temperature range for the SI7615DN-T1-GE3 is -55°C to 150°C, with a storage temperature range of -55°C to 150°C.
  • To handle ESD protection, use an ESD wrist strap or mat, and ensure the PCB is designed with ESD protection in mind, such as using ESD diodes or resistors.
  • The recommended input capacitance for the SI7615DN-T1-GE3 is 10 nF to 100 nF, depending on the specific application and noise requirements.

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SI7615DN-T1-GE3 Overview

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