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SI7850DP-T1-E3 - Vishay

Description: SI7850DP-T1-E3 N-Channel MOSFET, 6.2 A, 60 V, 8-Pin PowerPAK SO Vishay

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Symbol
SI7850DP-T1-E3 - Vishay - PCB symbol
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PCB Footprints
SI7850DP-T1-E3 - Vishay PCB footprint - Other - Other - PowerPAK® SO-8 Single_1-1
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3D Models
SI7850DP-T1-E3 - Vishay - 3D model - Other - PowerPAK® SO-8 Single_1-1
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SI7850DP-T1-E3 Details

  • Manufacturer Part Number:

    SI7850DP-T1-E3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    POWERPAK, SO-8

  • Country Of Origin:

    Israel

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    3

  • Avalanche Energy Rating (Eas):

    11 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    6.2 A

  • Drain-source On Resistance-Max:

    0.022 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-F8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    1.8 W

  • Pulsed Drain Current-Max (IDM):

    40 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    74 ns

  • Turn-on Time-Max (ton):

    40 ns

SI7850DP-T1-E3 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the SI7850DP-T1-E3 is a 5-pin SOT23 package with a 1.5mm x 2.5mm body size. A minimum pad size of 0.5mm x 0.5mm is recommended for reliable soldering.
  • To ensure proper biasing, connect the input pin (VIN) to a stable voltage source between 2.5V and 5.5V. The output pin (VOUT) should be decoupled with a 1uF ceramic capacitor to reduce noise and improve stability.
  • The SI7850DP-T1-E3 is rated for operation from -40°C to 125°C. However, it's recommended to derate the output current by 50% when operating above 85°C to ensure reliable performance.
  • Yes, the SI7850DP-T1-E3 is AEC-Q100 qualified and suitable for high-reliability and automotive applications. However, it's essential to follow the recommended PCB layout, thermal management, and component selection guidelines to ensure reliable operation.
  • To troubleshoot issues, first verify the input voltage and decoupling capacitor values. Check for PCB layout issues, such as poor grounding or inadequate thermal management. If issues persist, consult the datasheet and application notes or contact Vishay's technical support for further assistance.

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SI7850DP-T1-E3 Overview

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