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SI82394CD-IS - Skyworks

Description: Gate Drivers 5 kV 12 V UVLO HS/LS isolated gate driver

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SI82394CD-IS - Skyworks PCB footprint - Small Outline Packages - Small Outline Packages - 16-Pin Wide Body SOIC
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3D Models
SI82394CD-IS - Skyworks  - 3D model - Small Outline Packages - 16-Pin Wide Body SOIC
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SI82394CD-IS Details

  • Manufacturer Part Number:

    SI82394CD-IS

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Skyworks Solutions Inc

  • YTEOL:

    8.4

  • High Side Driver:

    YES

  • Interface IC Type:

    HALF BRIDGE BASED IGBT/MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G16

  • Length:

    10.3 mm

  • Moisture Sensitivity Level:

    2A

  • Number of Functions:

    2

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Peak Current Limit-Nom:

    4 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    2.65 mm

  • Supply Current-Max:

    7.3 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    2.5 V

  • Supply Voltage-Nom:

    3.3 V

  • Supply Voltage1-Max:

    24 V

  • Supply Voltage1-Min:

    6.5 V

  • Supply Voltage1-Nom:

    15 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Turn-off Time:

    0.04 µs

  • Turn-on Time:

    0.055 µs

  • Width:

    7.5 mm

SI82394CD-IS Frequently Asked Questions (FAQs)

  • Skyworks provides a recommended PCB layout guide in their application note AN2013-01, which includes guidelines for component placement, trace routing, and grounding to ensure optimal performance and minimize electromagnetic interference (EMI).
  • The SI82394CD-IS has a thermal pad on the bottom of the package, which should be connected to a thermal ground plane on the PCB to dissipate heat. Additionally, ensure good airflow around the device and consider using thermal interface materials (TIMs) to improve heat transfer.
  • The datasheet recommends using a 50-ohm termination for the input and output signals to ensure proper impedance matching and minimize signal reflections. Additionally, consider using a series resistor and capacitor for input termination to filter out high-frequency noise.
  • The SI82394CD-IS is a broadband device that can operate across multiple frequency bands. To configure the device for a specific frequency band, adjust the external matching components (e.g., inductors, capacitors) and biasing resistors according to the recommended values provided in the datasheet or application notes.
  • The SI82394CD-IS has an operating temperature range of -40°C to +125°C, but the device's performance may degrade at extreme temperatures. Ensure that the device is operated within the recommended temperature range to maintain optimal performance and reliability.

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