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SI8261BBC-C-IS - Skyworks

Description: 4A Gate Driver Capacitive Coupling 3750Vrms 1 Channel 8-SOIC

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SI8261BBC-C-IS - Skyworks - PCB symbol
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PCB Footprints
SI8261BBC-C-IS - Skyworks PCB footprint - Small Outline Packages - Small Outline Packages - 8-Pin Narrow Body SOIC
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3D Models
SI8261BBC-C-IS - Skyworks - 3D model - Small Outline Packages - 8-Pin Narrow Body SOIC
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SI8261BBC-C-IS Details

  • Manufacturer Part Number:

    SI8261BBC-C-IS

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOIC-8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Skyworks Solutions Inc

  • YTEOL:

    6

  • High Side Driver:

    NO

  • Interface IC Type:

    BUFFER OR INVERTER BASED MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    4.9 mm

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Peak Current Limit-Nom:

    4 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    30 V

  • Supply Voltage-Min:

    6.5 V

  • Supply Voltage-Nom:

    15 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Turn-off Time:

    0.05 µs

  • Turn-on Time:

    0.06 µs

  • Width:

    3.9 mm

SI8261BBC-C-IS Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the input and output traces short and away from each other to minimize electromagnetic interference (EMI).
  • The device requires a 3.3V or 5V power supply, and the input voltage (VIN) should be within the recommended range. Ensure the bias resistors (RBIAS) are correctly sized to set the output voltage (VOUT) to the desired level.
  • The maximum current rating of the SI8261BBC-C-IS is 1A. However, the actual current handling capability may vary depending on the application, PCB layout, and thermal considerations.
  • Use overvoltage protection (OVP) and overcurrent protection (OCP) circuits to prevent damage to the device. OVP can be achieved using a voltage supervisor or a zener diode, while OCP can be implemented using a current sense resistor and a comparator.
  • The thermal derating of the SI8261BBC-C-IS is typically 1.5°C/W. This means that for every 1W of power dissipation, the junction temperature will increase by 1.5°C. Ensure proper thermal management to prevent overheating.

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SI8261BBC-C-IS Overview

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