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SI8388P-IU - Skyworks

Description: General Purpose Digital Isolator 2500Vrms 8 Channel 2Mbps CMTI 20-SSOP (0.154", 3.90mm Width)

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Symbol
SI8388P-IU - Skyworks - PCB symbol
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PCB Footprints
SI8388P-IU - Skyworks PCB footprint - Other - Other - 20-QSOP
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3D Models
SI8388P-IU - Skyworks - 3D model - Other - 20-QSOP
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SI8388P-IU Details

  • Manufacturer Part Number:

    SI8388P-IU

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    QSOP-20

  • Country Of Origin:

    Thailand

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Skyworks Solutions Inc

  • Interface IC Type:

    DIGITAL I/P MODULE

  • Interface Standard:

    GENERAL PURPOSE

  • JESD-30 Code:

    R-PDSO-G20

  • JESD-609 Code:

    e4

  • Length:

    8.66 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    8

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SSOP20,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    2.25 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    NICKEL PALLADIUM GOLD

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.635 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    3.91 mm

SI8388P-IU Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1mm clearance around the device for heat dissipation. Use a thermal pad and thermal interface material for efficient heat transfer.
  • Use a Smith chart or simulation tools like ADS or AWR to design and optimize the input and output matching networks. Consider the device's S-parameters and the system's impedance requirements.
  • Apply a 2.7V to 3.3V DC bias to the VCC pin, and ensure a proper power-up sequence: VCC, then VEN, and finally the RF input signal. Use a 10uF capacitor for decoupling.
  • Use ESD-protective packaging and handling procedures. Ensure all personnel handling the device wear ESD-protective wrist straps or use ESD-protective mats. Use a static-dissipative workstation and follow proper assembly and soldering techniques.
  • The SI8388P-IU has undergone rigorous qualification tests, including temperature cycling, humidity testing, and mechanical stress testing, to ensure reliability and compliance with industry standards.

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SI8388P-IU Overview

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