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SI8751AB-ISR - Skyworks

Description: Gate Drivers Isolated FET driver with pin control

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SI8751AB-ISR - Skyworks - PCB symbol
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PCB Footprints
SI8751AB-ISR - Skyworks PCB footprint - Small Outline Packages - Small Outline Packages - SI8620BC-B-IS
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3D Models
SI8751AB-ISR - Skyworks - 3D model - Small Outline Packages - SI8620BC-B-IS
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SI8751AB-ISR Details

  • Manufacturer Part Number:

    SI8751AB-ISR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOIC-8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Skyworks Solutions Inc

  • YTEOL:

    6

  • High Side Driver:

    NO

  • Interface IC Type:

    BUFFER OR INVERTER BASED MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    2A

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    9.5 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    2.25 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Turn-off Time:

    35 µs

  • Turn-on Time:

    650 µs

  • Width:

    3.9 mm

SI8751AB-ISR Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the signal traces short and away from the power plane to minimize noise and radiation.
  • Ensure proper thermal management by providing adequate heat sinking and airflow. Use a thermal interface material (TIM) between the device and the heat sink, and follow the recommended operating temperature range of -40°C to 125°C.
  • The SI8751AB-ISR has built-in ESD protection, but it's still recommended to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that the device is handled in a static-safe environment.
  • No, the SI8751AB-ISR is designed for isolated applications only. Using it in a non-isolated application may compromise the device's performance and reliability.
  • Power up the VCC supply first, followed by the VISO supply. Ensure that the VISO supply is powered up within 10 ms of the VCC supply to prevent latch-up.

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SI8751AB-ISR Overview

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