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SI8819EDB-T2-E1 - Vishay

Description: P-Channel 12 V 2.9A (Ta) 900mW (Ta) Surface Mount 4-MICRO FOOT® (0.8x0.8), -55°C ~ 150°C (TJ)

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PCB Footprints
SI8819EDB-T2-E1 - Vishay PCB footprint - Other - Other - MICRO FOOT_2025
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SI8819EDB-T2-E1 - Vishay  - 3D model - Other - MICRO FOOT_2025
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SI8819EDB-T2-E1 Details

  • Manufacturer Part Number:

    SI8819EDB-T2-E1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    5

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    12 V

  • Drain Current-Max (ID):

    2.1 A

  • Drain-source On Resistance-Max:

    0.1 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    130 pF

  • JESD-30 Code:

    S-PBGA-B4

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    4

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Surface Mount:

    YES

  • Terminal Finish:

    Pure Matte Tin (Sn)

  • Terminal Form:

    BALL

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

SI8819EDB-T2-E1 Frequently Asked Questions (FAQs)

  • A good PCB layout for the SI8819EDB-T2-E1 should minimize parasitic inductance and capacitance. Keep the input and output traces short and wide, and use a solid ground plane to reduce EMI. Also, ensure that the device is placed away from high-frequency noise sources and heat-generating components.
  • To ensure reliability in high-temperature applications, follow the recommended operating temperature range (up to 150°C) and derate the device's power dissipation accordingly. Also, ensure good thermal conductivity between the device and the PCB, and consider using a heat sink if necessary.
  • The SI8819EDB-T2-E1 has built-in ESD protection, but it's still important to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that the device is not exposed to static electricity during handling.
  • Yes, the SI8819EDB-T2-E1 can be used in switching regulator applications, but ensure that the device is properly biased and that the switching frequency is within the recommended range. Also, consider the device's power dissipation and thermal management in the design.
  • To troubleshoot issues with the SI8819EDB-T2-E1, start by verifying the device's pinout and connections. Check for proper biasing, and ensure that the input and output capacitors are properly sized and connected. Use an oscilloscope to monitor the device's input and output waveforms, and consult the datasheet for troubleshooting guidelines.

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SI8819EDB-T2-E1 Overview

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