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SIA453EDJ-T1-GE3 - Vishay

Description: MOSFET RECOMMENDED ALT 78-SIA441DJ-T1-GE3

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SIA453EDJ-T1-GE3 - Vishay - PCB symbol
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PCB Footprints
SIA453EDJ-T1-GE3 - Vishay PCB footprint - Other - Other - PowerPAK-SC-70-6L_Single
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SIA453EDJ-T1-GE3 - Vishay - 3D model - Other - PowerPAK-SC-70-6L_Single
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SIA453EDJ-T1-GE3 Details

  • Manufacturer Part Number:

    SIA453EDJ-T1-GE3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    SC-70, 6 PIN

  • ECCN Code:

    EAR99

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    0

  • Avalanche Energy Rating (Eas):

    5 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    24 A

  • Drain-source On Resistance-Max:

    0.026 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    S-PDSO-N6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Pulsed Drain Current-Max (IDM):

    80 A

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

SIA453EDJ-T1-GE3 Frequently Asked Questions (FAQs)

  • The recommended land pattern for SIA453EDJ-T1-GE3 can be found in the Vishay Intertechnologies' application note 'Land Pattern Recommendations for Vishay's SIA453EDJ-T1-GE3' or by consulting with a PCB design expert.
  • Proper thermal management of SIA453EDJ-T1-GE3 involves ensuring good thermal conductivity between the device and the PCB, using thermal vias, and providing adequate airflow. Consult the datasheet and application notes for specific guidelines.
  • ESD protection and handling precautions for SIA453EDJ-T1-GE3 include using anti-static wrist straps, mats, and bags, as well as following proper handling and storage procedures to prevent damage. Refer to the datasheet and industry standards for more information.
  • While SIA453EDJ-T1-GE3 is a high-quality component, its suitability for high-reliability or aerospace applications depends on specific requirements and certifications. Consult with Vishay Intertechnologies or a qualified engineer to determine its suitability for your specific application.
  • The recommended PCB material for SIA453EDJ-T1-GE3 is a high-Tg FR4 or equivalent, with a minimum thickness of 0.8 mm to ensure proper thermal management and mechanical stability.

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SIA453EDJ-T1-GE3 Overview

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