SIA918EDJ-T1-GE3 footprint, schematic symbol and 3D model by Vishay

Symbol

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PCB Footprints

SIA918EDJ-T1-GE3 - Vishay PCB footprint - Other - Other - SIA918EDJ-T1-GE3-2

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3D Models

SIA918EDJ-T1-GE3 - Vishay - 3D model - Other - SIA918EDJ-T1-GE3-2

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Datasheet Download Datasheet
Stock & Prices Price & Stock for SIA918EDJ-T1-GE3
Part Number SIA918EDJ-T1-GE3
Manufacturer Vishay
Pin Count 8
Part Category MOSFET (N-Channel)
Package Category Other
Footprint Name Other - SIA918EDJ-T1-GE3-2
Released Date Sep 14, 2023
Last Modified Date Sep 15, 2023 6:25 AM UTC
Pinout / Pin List Click Here (Member Only)

SIA918EDJ-T1-GE3 Details

Manufacturer Part Number:
SIA918EDJ-T1-GE3
Rohs Code:
Yes
Part Life Cycle Code:
Active
Package Description:
SC-70, 6 PIN
ECCN Code:
EAR99
Factory Lead Time:
14 Weeks
Date Of Intro:
2016-07-19
Manufacturer:
Vishay Intertechnologies
Case Connection:
DRAIN
Configuration:
SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE
DS Breakdown Voltage-Min:
30 V
Drain Current-Max (ID):
4.5 A
Drain-source On Resistance-Max:
0.065 Ω
FET Technology:
METAL-OXIDE SEMICONDUCTOR
JESD-30 Code:
S-PDSO-N6
Number of Elements:
2
Number of Terminals:
6
Operating Mode:
ENHANCEMENT MODE
Operating Temperature-Max:
150 °C
Operating Temperature-Min:
-55 °C
Package Body Material:
PLASTIC/EPOXY
Package Shape:
SQUARE
Package Style:
SMALL OUTLINE
Peak Reflow Temperature (Cel):
NOT SPECIFIED
Polarity/Channel Type:
N-CHANNEL
Power Dissipation-Max (Abs):
7.8 W
Pulsed Drain Current-Max (IDM):
15 A
Surface Mount:
YES
Terminal Form:
NO LEAD
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
NOT SPECIFIED
Transistor Application:
SWITCHING
Transistor Element Material:
SILICON
Turn-off Time-Max (toff):
140 ns
Turn-on Time-Max (ton):
70 ns

SIA918EDJ-T1-GE3 Frequently Asked Questions (FAQs)

The recommended land pattern for SIA918EDJ-T1-GE3 is a rectangular pad with a size of 2.5 mm x 1.5 mm, with a non-solder mask defined (NSMD) pad shape. This ensures proper soldering and thermal performance.
To ensure proper thermal management, it's recommended to use a thermal pad or a heat sink with a thermal interface material (TIM) to dissipate heat. The thermal pad should be at least 1 mm thick and have a thermal conductivity of 1 W/m-K or higher.
The maximum operating temperature range for SIA918EDJ-T1-GE3 is -55°C to 150°C. However, it's recommended to operate the device within the specified temperature range of -40°C to 125°C for optimal performance and reliability.
Yes, SIA918EDJ-T1-GE3 is designed to withstand high-vibration environments. However, it's recommended to follow proper mounting and soldering techniques to ensure the device remains securely attached to the PCB. Additionally, consider using a vibration-dampening material or a shock-absorbing mount to minimize the impact of vibrations.
To ensure reliability in a humid environment, it's recommended to use a conformal coating or a moisture-resistant material to protect the device from moisture ingress. Additionally, follow proper storage and handling procedures to prevent moisture absorption during transportation and storage.

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SIA918EDJ-T1-GE3 Overview

Use the download button to access the SIA918EDJ-T1-GE3 schematic symbol, PCB footprint, and 3D model.

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SIA918EDJ-T1-GE3 - Vishay

SIA918EDJ-T1-GE3 Details

SIA918EDJ-T1-GE3 Frequently Asked Questions (FAQs)

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