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SIC0660P-BP - MCC

Description: SIC SBD

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PCB Footprints
SIC0660P-BP - MCC PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-220AC
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3D Models
SIC0660P-BP - MCC  - 3D model - Transistor Outline, Vertical - TO-220AC
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SIC0660P-BP Details

  • Manufacturer Part Number:

    SIC0660P-BP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    5.42

  • Additional Feature:

    PD-CASE

  • Application:

    GENERAL PURPOSE

  • Breakdown Voltage-Min:

    650 V

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON CARBIDE

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.6 V

  • JEDEC-95 Code:

    TO-220AC

  • JESD-30 Code:

    R-PSFM-T2

  • Non-rep Pk Forward Current-Max:

    45 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    6 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Power Dissipation-Max:

    100 W

  • Rep Pk Reverse Voltage-Max:

    650 V

  • Reverse Current-Max:

    30 µA

  • Reverse Test Voltage:

    650 V

  • Surface Mount:

    NO

  • Technology:

    SCHOTTKY

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

SIC0660P-BP Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for SIC0660P-BP is a standard SOD-323 package with a 1.7mm x 1.3mm body size and 0.5mm lead pitch. A minimum pad size of 0.8mm x 0.8mm is recommended for reliable soldering.
  • To ensure reliable operation of SIC0660P-BP in high-temperature environments, it is recommended to follow proper thermal management practices, such as providing adequate heat sinking, using a thermally conductive PCB material, and minimizing power dissipation. Additionally, the device should be operated within its specified temperature range of -55°C to 150°C.
  • The maximum allowable voltage on the gate of SIC0660P-BP is ±20V. Exceeding this voltage may damage the device or affect its reliability.
  • Yes, SIC0660P-BP can be used in switching applications due to its fast switching times (tr < 10ns, tf < 10ns) and low gate charge (Qg < 10nC). However, it is essential to ensure that the device is operated within its specified voltage and current ratings to prevent damage or degradation.
  • To handle ESD protection for SIC0660P-BP, it is recommended to follow proper ESD handling procedures, such as using an ESD wrist strap or mat, and storing the devices in anti-static packaging. Additionally, the device should be handled in a clean and dry environment to prevent moisture-related damage.

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SIC0660P-BP Overview

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