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SiC437BED-T1-GE3 - Vishay

Description: Buck Switching Regulator IC Positive Adjustable 0.6V 1 Output 12A 24-PowerWFQFN

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SiC437BED-T1-GE3 - Vishay PCB footprint - Other - Other - SiC437BED-T1-GE3-7
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SiC437BED-T1-GE3 - Vishay  - 3D model - Other - SiC437BED-T1-GE3-7
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SiC437BED-T1-GE3 Details

  • Manufacturer Part Number:

    SIC437BED-T1-GE3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Japan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    8

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    VOLTAGE-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    28 V

  • Input Voltage-Min:

    4.5 V

  • Input Voltage-Nom:

    12 V

  • JESD-30 Code:

    S-XQCC-N24

  • JESD-609 Code:

    e3

  • Length:

    4 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    12 A

  • Output Voltage-Max:

    25.2 V

  • Output Voltage-Min:

    0.6 V

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    VQCCN

  • Package Equivalence Code:

    LCC24,.16SQ,18

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.8 mm

  • Supply Current-Max (Isup):

    0.12 mA

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    1000 kHz

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.45 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4 mm

SiC437BED-T1-GE3 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the SIC437BED-T1-GE3 is a thermal pad with a minimum size of 2.5 mm x 2.5 mm, with a thermal via array underneath to ensure efficient heat dissipation.
  • To ensure proper soldering, use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the thermal pad. Use a soldering technique that minimizes the risk of overheating the component.
  • The maximum operating temperature range for the SIC437BED-T1-GE3 is -55°C to 175°C, with a maximum junction temperature of 175°C.
  • Store the SIC437BED-T1-GE3 in its original packaging, away from direct sunlight and moisture. Avoid bending, flexing, or applying excessive pressure to the component during handling and shipping.
  • Recommended TIMs for the SIC437BED-T1-GE3 include thermal grease, thermal tape, or thermal pads with a thermal conductivity of at least 1 W/m-K.

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SiC437BED-T1-GE3 Overview

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