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SIC461ED-T1-GE3 - Vishay

Description: Buck Switching Regulator IC Positive Adjustable 0.8V 1 Output 10A PowerPAK® MLP55-27

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PCB Footprints
SIC461ED-T1-GE3 - Vishay PCB footprint - Other - Other -  PowerPAK® MLP55-27L
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3D Models
SIC461ED-T1-GE3 - Vishay  - 3D model - Other -  PowerPAK® MLP55-27L
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SIC461ED-T1-GE3 Details

  • Manufacturer Part Number:

    SIC461ED-T1-GE3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Japan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    16 Weeks

  • Date Of Intro:

    2017-11-16

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    8

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    VOLTAGE-MODE

  • Control Technique:

    CONSTANT ON TIME

  • Input Voltage-Max:

    60 V

  • Input Voltage-Min:

    4.5 V

  • Input Voltage-Nom:

    48 V

  • JESD-30 Code:

    S-XQCC-N27

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    27

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    15.6 A

  • Output Voltage-Max:

    55.2 V

  • Output Voltage-Min:

    0.8 V

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    VQCCN

  • Package Equivalence Code:

    LCC27,.2SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.8 mm

  • Supply Current-Max (Isup):

    0.325 mA

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    2000 kHz

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5 mm

SIC461ED-T1-GE3 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the SIC461ED-T1-GE3 is a 5-pin TO-252 package with a minimum pad size of 1.5 mm x 1.5 mm and a thermal pad size of 2.5 mm x 2.5 mm.
  • To ensure reliability in high-temperature applications, it is recommended to follow the recommended operating conditions, use a suitable thermal interface material, and ensure good thermal conduction to a heat sink or heat spreader.
  • The maximum allowed power dissipation for the SIC461ED-T1-GE3 is 150 W at a case temperature of 25°C, and it decreases with increasing temperature.
  • To protect the SIC461ED-T1-GE3 from ESD, it is recommended to handle the device in an ESD-protected environment, use ESD-protective packaging, and follow proper handling and storage procedures.
  • The recommended storage condition for the SIC461ED-T1-GE3 is in a dry, cool place with a temperature range of -40°C to 30°C and a relative humidity of 60% or less.

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SIC461ED-T1-GE3 Overview

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