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SICU0260B-TP - MCC

Description: Diode 650 V 2A Surface Mount DPAK

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SICU0260B-TP - MCC PCB footprint - Other - Other - SICU0260B-TP
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SICU0260B-TP Details

  • Manufacturer Part Number:

    SICU0260B-TP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    DPAK-3/2

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    7

  • Application:

    EFFICIENCY

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON CARBIDE

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.6 V

  • JESD-30 Code:

    R-PSSO-G2

  • Non-rep Pk Forward Current-Max:

    22 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    2 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Power Dissipation-Max:

    33 W

  • Rep Pk Reverse Voltage-Max:

    650 V

  • Reverse Current-Max:

    10 µA

  • Reverse Test Voltage:

    650 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

SICU0260B-TP Frequently Asked Questions (FAQs)

  • The recommended PCB layout and land pattern for SICU0260B-TP can be found in the Micro Commercial Components' application note AN-113, which provides guidelines for optimal performance and thermal management.
  • To ensure reliable operation in high-temperature environments, it is recommended to follow the thermal management guidelines provided in the datasheet, including the use of a heat sink and thermal interface material. Additionally, the device should be operated within the specified temperature range and derated according to the thermal derating curve.
  • The SICU0260B-TP has built-in ESD protection, but it is still recommended to follow standard ESD handling precautions, such as using an ESD wrist strap or mat, and handling the device by the body rather than the leads. The device should also be stored in an anti-static bag or tube when not in use.
  • The SICU0260B-TP is a commercial-grade device, but Micro Commercial Components offers a range of high-reliability and aerospace-grade devices that meet the requirements of MIL-PRF-19500 and other relevant standards. Contact Micro Commercial Components for more information on their high-reliability product offerings.
  • The recommended soldering profile for SICU0260B-TP is a peak temperature of 260°C for 10-15 seconds, with a ramp-up rate of 3°C/second and a ramp-down rate of 6°C/second. It is also recommended to use a solder with a melting point of 217°C or higher.

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SICU0260B-TP Overview

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