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SID1152K-TL - Power Integrations

Description: Gate Drivers Sgl Ch 5.0A Fluxlink 250kHz Delay 260ns

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SID1152K-TL - Power Integrations PCB footprint - Other - Other - eSOP-R16B_2022
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SID1152K-TL Details

  • Manufacturer Part Number:

    SID1152K-TL

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Power Integrations

  • YTEOL:

    8.1

  • High Side Driver:

    NO

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    BUFFER OR INVERTER BASED IGBT/MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G15

  • Length:

    10.16 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    15

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    OPEN-DRAIN

  • Output Peak Current Limit-Nom:

    5 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HSOP

  • Package Equivalence Code:

    SOP15/16,.46

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    2.67 mm

  • Supply Current-Max:

    23 mA

  • Supply Voltage-Max:

    5.25 V

  • Supply Voltage-Min:

    4.75 V

  • Supply Voltage-Nom:

    5 V

  • Supply Voltage1-Max:

    28 V

  • Supply Voltage1-Min:

    22 V

  • Supply Voltage1-Nom:

    25 V

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Turn-off Time:

    359 µs

  • Turn-on Time:

    364 µs

  • Width:

    8.89 mm

SID1152K-TL Frequently Asked Questions (FAQs)

  • A 2-layer PCB with a solid ground plane on the bottom layer and a thermal relief pattern on the top layer is recommended. This helps to dissipate heat efficiently and reduces thermal resistance.
  • Ensure that the device is operated within the recommended temperature range (up to 150°C). Use a suitable thermal interface material (TIM) and ensure good thermal contact between the device and the heat sink. Also, follow the recommended derating guidelines for high-temperature operation.
  • A low-ESR ceramic capacitor (e.g., X7R or X5R) with a value of 10-22 μF is recommended. This helps to filter the input voltage and reduce ripple.
  • Use a combination of capacitors and inductors to filter the output voltage. A 2-stage LC filter with a 10-22 μF capacitor and a 1-2 μH inductor is recommended. This helps to reduce ripple and noise to acceptable levels.
  • A low-RDS(on) MOSFET with a high current rating (e.g., 30-50 A) and a suitable gate-source voltage rating (e.g., 20-30 V) is recommended. Ensure that the MOSFET is compatible with the device's switching frequency and voltage ratings.

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SID1152K-TL Overview

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