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SIDR170DP-T1-RE3 - Vishay

Description: N-Channel 100 V 23.2A (Ta), 95A (Tc) 6.25W (Ta), 125W (Tc) Surface Mount PowerPAK® SO-8DC

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PCB Footprints
SIDR170DP-T1-RE3 - Vishay PCB footprint - Other - Other - PowerPAK SO-8DC_2022
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3D Models
SIDR170DP-T1-RE3 - Vishay  - 3D model - Other - PowerPAK SO-8DC_2022
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SIDR170DP-T1-RE3 Details

  • Manufacturer Part Number:

    SIDR170DP-T1-RE3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SO-8DC, 8 PIN

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    24 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    6

  • Avalanche Energy Rating (Eas):

    61.2 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    100 V

  • Drain Current-Max (ID):

    95 A

  • Drain-source On Resistance-Max:

    0.0048 Ω

  • FET Technology:

    TRENCH MOSFET

  • Feedback Cap-Max (Crss):

    20 pF

  • JESD-30 Code:

    R-PDSO-N8

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    125 W

  • Pulsed Drain Current-Max (IDM):

    200 A

  • Surface Mount:

    YES

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    116 ns

  • Turn-on Time-Max (ton):

    56 ns

SIDR170DP-T1-RE3 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for SIDR170DP-T1-RE3 is a rectangular pad with a minimum size of 2.5 mm x 1.5 mm, with a 0.5 mm radius corner and a 0.3 mm spacing between pads.
  • To ensure reliable soldering, use a soldering iron with a temperature range of 250°C to 260°C, and apply a solder flux with a moderate activity level. Avoid using excessive solder or flux, and ensure the component is properly aligned on the PCB.
  • The maximum operating temperature range for SIDR170DP-T1-RE3 is -40°C to 150°C, with a derating of 1.33% per °C above 125°C.
  • Yes, SIDR170DP-T1-RE3 is designed to withstand high-vibration environments, with a vibration rating of 10 G peak acceleration, 10 Hz to 2000 Hz, and 3 axes.
  • To handle ESD protection for SIDR170DP-T1-RE3, use a wrist strap or mat with a resistance of 1 MΩ to 10 MΩ, and ensure the component is stored in an ESD-protected environment.

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SIDR170DP-T1-RE3 Overview

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