Vishay recommends a PCB layout with a thermal pad connected to a large copper area to dissipate heat efficiently. A minimum of 2 oz copper thickness is recommended, and the thermal pad should be connected to a ground plane or a heat sink.
To ensure reliable soldering, follow the recommended soldering profile: peak temperature of 260°C, soldering time of 3-5 seconds, and a soldering iron with a temperature range of 200-240°C. Use a solder with a melting point of 180-220°C.
The maximum allowed voltage derating for the SIDR402DP-T1-GE3 is 80% of the rated voltage. This means that if the rated voltage is 400V, the maximum allowed voltage derating would be 320V.
While the SIDR402DP-T1-GE3 is suitable for high-frequency applications, its performance may degrade above 100 kHz. For frequencies above 100 kHz, consider using a more specialized device or consulting with a Vishay application engineer.
To handle ESD protection, follow standard ESD handling procedures: use an ESD wrist strap or mat, handle devices by the body or leads, and avoid touching the device's pins. The SIDR402DP-T1-GE3 has an ESD rating of 2 kV human body model (HBM) and 150 V machine model (MM).
Trust Checks
This model has been provided by an expert contributor.
Expert Contribution
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
SIDR402DP-T1-GE3 Overview
Use the download button to access the SIDR402DP-T1-GE3 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like SIDR4,
or try a keyword search, such as Power Field-Effect Transistors
