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SIDR500EP-T1-RE3 - Vishay

Description: MOSFETs PPAKSO8 N-CH 30V 94A

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PCB Footprints
SIDR500EP-T1-RE3 - Vishay PCB footprint - Other - Other - PowerPAK SO-8 Single
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3D Models
SIDR500EP-T1-RE3 - Vishay  - 3D model - Other - PowerPAK SO-8 Single
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SIDR500EP-T1-RE3 Details

  • Manufacturer Part Number:

    SIDR500EP-T1-RE3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Vishay Intertechnologies

SIDR500EP-T1-RE3 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the SIDR500EP-T1-RE3 is a rectangular pad with a minimum size of 2.5 mm x 1.5 mm, with a 0.5 mm radius corner and a 0.3 mm spacing between pads.
  • To ensure reliable soldering, use a soldering iron with a temperature range of 250°C to 260°C, and apply a solder flux with a moderate activity level. Avoid using excessive solder or flux, and ensure the component is properly aligned on the PCB.
  • The maximum allowed voltage derating for the SIDR500EP-T1-RE3 is 10% of the rated voltage, which is 500 V. Therefore, the maximum allowed voltage derating is 50 V.
  • While the SIDR500EP-T1-RE3 is designed for high-voltage applications, it is not optimized for high-frequency use. For frequencies above 100 kHz, consider using a different component or consulting with a Vishay application engineer.
  • To prevent ESD damage, handle the SIDR500EP-T1-RE3 with ESD-protective equipment, such as wrist straps, mats, or bags. Ensure the workspace is ESD-safe, and avoid touching the component's pins or leads.

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SIDR500EP-T1-RE3 Overview

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