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SIDR622DP-T1-GE3 - Vishay

Description: N-Channel 150 V (D-S) MOSFET

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SIDR622DP-T1-GE3 - Vishay PCB footprint - Other - Other - PowerPAK SO-8 Single
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SIDR622DP-T1-GE3 - Vishay  - 3D model - Other - PowerPAK SO-8 Single
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SIDR622DP-T1-GE3 Details

  • Manufacturer Part Number:

    SIDR622DP-T1-GE3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.29.00.95

  • Factory Lead Time:

    29 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    6.12

  • Avalanche Energy Rating (Eas):

    80 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    150 V

  • Drain Current-Max (ID):

    56.7 A

  • Drain-source On Resistance-Max:

    0.0177 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    10.5 pF

  • JESD-30 Code:

    R-PDSO-N8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    125 W

  • Pulsed Drain Current-Max (IDM):

    100 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    44 ns

  • Turn-on Time-Max (ton):

    46 ns

SIDR622DP-T1-GE3 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the SIDR622DP-T1-GE3 is a pad layout with a minimum size of 2.5 mm x 2.5 mm, with a 1.5 mm diameter thermal pad in the center, and a 0.5 mm gap between the pads and the thermal pad.
  • To ensure reliable soldering, use a soldering iron with a temperature range of 250°C to 260°C, and apply a solder paste with a melting point of 217°C to 221°C. Also, ensure the PCB is clean and free of oxidation.
  • The maximum allowed voltage derating for the SIDR622DP-T1-GE3 is 10% of the rated voltage, which is 620 V. Therefore, the maximum allowed voltage derating is 62 V.
  • Yes, the SIDR622DP-T1-GE3 is suitable for high-frequency applications up to 1 MHz. However, it's essential to consider the device's parasitic inductance and capacitance when designing the circuit.
  • To handle thermal management, ensure good thermal conductivity between the device and the PCB, use a heat sink if necessary, and maintain a maximum junction temperature of 150°C.

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SIDR622DP-T1-GE3 Overview

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