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SIDR680DP-T1-GE3 - Vishay

Description: N-Channel MOSFET 80V Vds 20V Vgs PowerPAK SO-8DC

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SIDR680DP-T1-GE3 - Vishay PCB footprint - Other - Other - SIDR680DP-T1-GE3-3
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SIDR680DP-T1-GE3 - Vishay  - 3D model - Other - SIDR680DP-T1-GE3-3
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SIDR680DP-T1-GE3 Details

  • Manufacturer Part Number:

    SIDR680DP-T1-GE3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    SOP-8

  • Country Of Origin:

    Israel

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    24 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    3

  • Avalanche Energy Rating (Eas):

    80 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    80 V

  • Drain Current-Max (ID):

    100 A

  • Drain-source On Resistance-Max:

    0.0029 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    48 pF

  • JESD-30 Code:

    R-PDSO-N8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    125 W

  • Pulsed Drain Current-Max (IDM):

    200 A

  • Surface Mount:

    YES

  • Terminal Finish:

    TIN

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    80 ns

  • Turn-on Time-Max (ton):

    88 ns

SIDR680DP-T1-GE3 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the SIDR680DP-T1-GE3 is a rectangular pad with a minimum size of 2.5 mm x 1.5 mm, with a 0.5 mm radius corner and a 0.3 mm spacing between pads.
  • To ensure reliable soldering, use a soldering iron with a temperature range of 250°C to 260°C, and apply a small amount of solder paste to the PCB pads. Use a soldering technique that minimizes thermal shock and avoids overheating the component.
  • The maximum operating temperature range for the SIDR680DP-T1-GE3 is -40°C to 150°C, with a derating of 1.33% per °C above 125°C.
  • Yes, the SIDR680DP-T1-GE3 is suitable for high-reliability applications, as it meets the requirements of AEC-Q101 and is manufactured with a high-reliability process.
  • To handle ESD protection, use a wrist strap or mat that is grounded to the same point as the PCB, and handle the component by the body or leads, avoiding direct contact with the die. Use an ESD-protected workstation and follow standard ESD handling procedures.

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SIDR680DP-T1-GE3 Overview

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