Part Image

SIHB125N60EF-GE3 - Vishay

Description: MOSFET 600V N-CHANNEL

Download SIHB125N60EF-GE3 Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
3D Models
SIHB125N60EF-GE3 - Vishay  - 3D model
click to zoom
Note! To download footprints and symbols, use the build and request forms below

Build

Launch Build Wizard
Build Wizard not available for this package category!

Request (48 hours)

SIHB125N60EF-GE3 Details

  • Manufacturer Part Number:

    SIHB125N60EF-GE3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TO-263, D2PAK-3/2

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    20 Weeks

  • Date Of Intro:

    2020-02-16

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    6

  • Avalanche Energy Rating (Eas):

    88 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    600 V

  • Drain Current-Max (ID):

    25 A

  • Drain-source On Resistance-Max:

    0.125 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    6 pF

  • JEDEC-95 Code:

    TO-263AB

  • JESD-30 Code:

    R-PSSO-G2

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    179 W

  • Pulsed Drain Current-Max (IDM):

    66 A

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    106 ns

  • Turn-on Time-Max (ton):

    104 ns

SIHB125N60EF-GE3 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the SIHB125N60EF-GE3 is a TO-247-3L package with a minimum pad size of 6.5mm x 5.5mm and a thermal pad size of 3.5mm x 3.5mm. It's recommended to follow the land pattern recommended by Vishay in their application note AN-1035.
  • To ensure the reliability of the SIHB125N60EF-GE3 in high-temperature applications, it's recommended to follow Vishay's guidelines for thermal management, including using a heat sink with a thermal resistance of less than 1°C/W, and ensuring that the maximum junction temperature (Tj) does not exceed 150°C.
  • The maximum allowed voltage derating for the SIHB125N60EF-GE3 is 80% of the maximum rated voltage (600V) at high temperatures (above 100°C). This means that the maximum allowed voltage at high temperatures is 480V.
  • To protect the SIHB125N60EF-GE3 from electrical overstress (EOS), it's recommended to use a voltage clamp or a transient voltage suppressor (TVS) to limit the voltage spikes, and to ensure that the device is operated within its safe operating area (SOA).
  • The recommended gate drive voltage for the SIHB125N60EF-GE3 is between 10V and 15V, with a maximum gate-source voltage of ±20V. A higher gate drive voltage can improve the switching performance, but may also increase the power losses.

Trust Checks

No trust score is available for this model.
Trust Score Unavailable
Sponsored

SIHB125N60EF-GE3 Overview

Use the download button to access the SIHB125N60EF-GE3 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like SIHB1, or try a keyword search, such as Power Field-Effect Transistors

Parts related to SIHB125N60EF-GE3

Showing 0 results

Select Package Category

Package Categories

Datasheet PDF Preview