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SIHG32N50D-GE3 - Vishay

Description: MOSFET, N-CH, 500V, 30A, TO-247AC

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PCB Footprints
SIHG32N50D-GE3 - Vishay PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-247AC (High Voltage)
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3D Models
SIHG32N50D-GE3 - Vishay  - 3D model - Transistor Outline, Vertical - TO-247AC (High Voltage)
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SIHG32N50D-GE3 Details

  • Manufacturer Part Number:

    SIHG32N50D-GE3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • ECCN Code:

    EAR99

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    0

  • Avalanche Energy Rating (Eas):

    225 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    500 V

  • Drain Current-Max (ID):

    30 A

  • Drain-source On Resistance-Max:

    0.15 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    TO-247AC

  • JESD-30 Code:

    R-PSFM-T3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Polarity/Channel Type:

    N-CHANNEL

  • Pulsed Drain Current-Max (IDM):

    89 A

  • Surface Mount:

    NO

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

SIHG32N50D-GE3 Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the SIHG32N50D-GE3 is -40°C to 150°C, with a maximum junction temperature of 150°C.
  • Proper thermal management can be achieved by ensuring good heat sink contact, using a thermal interface material, and maintaining a low thermal resistance between the device and the heat sink.
  • The recommended gate resistor value for the SIHG32N50D-GE3 is typically in the range of 10 ohms to 20 ohms, depending on the specific application and switching frequency.
  • Yes, the SIHG32N50D-GE3 can be used in a parallel configuration, but it's essential to ensure that the devices are properly matched, and the gate drive and thermal management are designed to handle the increased current and heat generation.
  • The maximum allowable voltage transient for the SIHG32N50D-GE3 is 600 V, with a maximum dv/dt of 10 kV/μs.

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SIHG32N50D-GE3 Overview

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Power Field-Effect Transistor, 30A I(D), 500V, 0.15ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-247AC