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SIHG73N60AE-GE3 - Vishay

Description: MOSFET 600V Vds 30V Vgs TO-247AC

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PCB Footprints
SIHG73N60AE-GE3 - Vishay PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-247AC_(H=5.21mm)
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3D Models
SIHG73N60AE-GE3 - Vishay  - 3D model - Transistor Outline, Vertical - TO-247AC_(H=5.21mm)
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SIHG73N60AE-GE3 Details

  • Manufacturer Part Number:

    SIHG73N60AE-GE3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    6.22

  • Avalanche Energy Rating (Eas):

    1019 mJ

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    600 V

  • Drain Current-Max (ID):

    60 A

  • Drain-source On Resistance-Max:

    0.04 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    8 pF

  • JEDEC-95 Code:

    TO-247AC

  • JESD-30 Code:

    R-PSFM-T3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    417 W

  • Pulsed Drain Current-Max (IDM):

    173 A

  • Surface Mount:

    NO

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    652 ns

  • Turn-on Time-Max (ton):

    278 ns

SIHG73N60AE-GE3 Frequently Asked Questions (FAQs)

  • The recommended gate resistor value for SIHG73N60AE-GE3 is typically between 10 ohms to 20 ohms, depending on the specific application and switching frequency. However, it's recommended to consult with the datasheet and application notes for more detailed guidance.
  • To ensure reliable operation of SIHG73N60AE-GE3 in high-temperature environments, it's essential to follow proper thermal management practices, such as using a heat sink, ensuring good airflow, and monitoring junction temperature. Additionally, derating the device's current and voltage ratings may be necessary at higher temperatures.
  • The maximum allowable voltage transient for SIHG73N60AE-GE3 is typically around 10% to 20% above the maximum rated voltage, depending on the duration and frequency of the transient. However, it's recommended to consult with the datasheet and application notes for more detailed guidance on voltage transient tolerance.
  • Yes, SIHG73N60AE-GE3 can be used in a parallel configuration to increase current handling, but it's essential to ensure that the devices are properly matched, and the gate drive and thermal management are designed to handle the increased current and heat generation.
  • The recommended dead-time for SIHG73N60AE-GE3 in a half-bridge configuration is typically around 1-2 microseconds, depending on the specific application and switching frequency. However, it's recommended to consult with the datasheet and application notes for more detailed guidance on dead-time requirements.

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SIHG73N60AE-GE3 Overview

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