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SII9022AYBT - Lattice Semiconductor

Description: Video ICs 16-Bit YCbCr Input HDMI 1.4a Transmitter, 1080p@60Hz, no HDCP, 49-ball BGA

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SII9022AYBT - Lattice Semiconductor PCB footprint - BGA - BGA - 49-Ball Package Dimensions
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SII9022AYBT - Lattice Semiconductor  - 3D model - BGA - 49-Ball Package Dimensions
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SII9022AYBT Details

  • Manufacturer Part Number:

    SII9022AYBT

  • Part Life Cycle Code:

    Active

  • Package Description:

    VFBGA-49

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Lattice Semiconductor Corporation

  • Consumer IC Type:

    CONSUMER CIRCUIT

  • JESD-30 Code:

    S-PBGA-B49

  • Length:

    4 mm

  • Number of Functions:

    1

  • Number of Terminals:

    49

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -20 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA49,7X7,20

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Seated Height-Max:

    0.8 mm

  • Surface Mount:

    YES

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Width:

    4 mm

SII9022AYBT Frequently Asked Questions (FAQs)

  • The recommended power-up sequence is to apply VCCIO first, followed by VCCINT, and then VREF. This ensures proper device operation and prevents latch-up.
  • To implement a reliable clock tree, use a clock tree with a single clock source, and use the device's built-in clock conditioning circuitry to minimize skew and jitter. Additionally, ensure that the clock signal is properly terminated and routed to minimize signal degradation.
  • For optimal performance, follow these guidelines: keep signal traces short and direct, use a solid ground plane, and avoid crossing signal traces over each other. Also, ensure that the device's power pins are decoupled with high-quality capacitors and that the PCB has adequate thermal relief.
  • To handle thermal management, ensure good airflow around the device, use a heat sink if necessary, and follow the recommended thermal design guidelines in the datasheet. Additionally, consider using thermal interface materials to improve heat transfer between the device and the heat sink.
  • To ensure signal integrity and minimize EMI, use controlled impedance traces, add series termination resistors, and use shielding or guard bands to reduce radiation. Additionally, follow the recommended layout and routing guidelines in the datasheet.

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