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SII9575CTUC - Lattice Semiconductor

Description: Video-Audio Interface ICs TQFP-176 RoHS

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SII9575CTUC - Lattice Semiconductor - PCB symbol
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SII9575CTUC - Lattice Semiconductor PCB footprint - Quad Flat Packages - Quad Flat Packages - 176 PIN LQFP
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SII9575CTUC - Lattice Semiconductor - 3D model - Quad Flat Packages - 176 PIN LQFP
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SII9575CTUC Details

  • Manufacturer Part Number:

    SII9575CTUC

  • Part Life Cycle Code:

    Active

  • Package Description:

    TQFP-176

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Date Of Intro:

    2017-10-10

  • Manufacturer:

    Lattice Semiconductor Corporation

  • Additional Feature:

    IT ALSO REQUIRES 3.14V TO 3.46V SUPPLY

  • Consumer IC Type:

    CONSUMER CIRCUIT

  • JESD-30 Code:

    S-PQFP-G176

  • Length:

    20 mm

  • Number of Functions:

    1

  • Number of Terminals:

    176

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTFQFP

  • Package Equivalence Code:

    TQFP176,.86SQ,16

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    1.35 V

  • Supply Voltage-Min (Vsup):

    1.25 V

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    QUAD

  • Width:

    20 mm

SII9575CTUC Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep signal traces short and away from noise sources. Use a 50-ohm impedance-controlled trace for high-speed signals.
  • Use a reliable configuration method such as JTAG or SPI flash. Ensure the configuration clock is stable and within the recommended frequency range. Verify the configuration data integrity using CRC or other error-checking mechanisms.
  • The SII9575CTUC has a maximum junction temperature of 125°C. Ensure good airflow around the device, and consider using a heat sink or thermal interface material for high-power applications.
  • Use the power-saving features of the FPGA, such as clock gating and dynamic voltage and frequency scaling. Optimize your design to minimize switching activity and use low-power modes when possible.
  • Use proper shielding, grounding, and decoupling to minimize EMI and RFI. Ensure that the PCB layout and component placement minimize radiation and susceptibility to external interference.

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