SIJ150DP-T1-GE3 footprint, schematic symbol and 3D model by Vishay

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PCB Footprints

SIJ150DP-T1-GE3 - Vishay PCB footprint - Other - Other - PowerPAK® SO-8 Single_111

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3D Models

SIJ150DP-T1-GE3 - Vishay - 3D model - Other - PowerPAK® SO-8 Single_111

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Datasheet Download Datasheet
Stock & Prices Price & Stock for SIJ150DP-T1-GE3
Part Number SIJ150DP-T1-GE3
Manufacturer Vishay
Pin Count 11
Part Category MOSFET (N-Channel)
Package Category Other
Footprint Name Other - PowerPAK® SO-8 Single_111
Released Date Jul 9, 2021
Last Modified Date Mar 7, 2023 4:10 PM UTC
Pinout / Pin List Click Here (Member Only)

SIJ150DP-T1-GE3 Details

Manufacturer Part Number:
SIJ150DP-T1-GE3
Rohs Code:
Yes
Part Life Cycle Code:
Active
Package Description:
SO-8L, 4 PIN
ECCN Code:
EAR99
Factory Lead Time:
24 Weeks
Manufacturer:
Vishay Intertechnologies
YTEOL:
5.6
Avalanche Energy Rating (Eas):
45 mJ
Case Connection:
DRAIN
Configuration:
SINGLE WITH BUILT-IN DIODE
DS Breakdown Voltage-Min:
45 V
Drain Current-Max (ID):
110 A
Drain-source On Resistance-Max:
0.0041 Ω
FET Technology:
METAL-OXIDE SEMICONDUCTOR
Feedback Cap-Max (Crss):
56 pF
JESD-30 Code:
R-PSSO-G4
Number of Elements:
1
Number of Terminals:
4
Operating Mode:
ENHANCEMENT MODE
Operating Temperature-Max:
150 °C
Operating Temperature-Min:
-55 °C
Package Body Material:
PLASTIC/EPOXY
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE
Peak Reflow Temperature (Cel):
260
Polarity/Channel Type:
N-CHANNEL
Power Dissipation-Max (Abs):
65.7 W
Pulsed Drain Current-Max (IDM):
300 A
Surface Mount:
YES
Terminal Form:
GULL WING
Terminal Position:
SINGLE
Time@Peak Reflow Temperature-Max (s):
40
Transistor Application:
SWITCHING
Transistor Element Material:
SILICON
Turn-off Time-Max (toff):
76 ns
Turn-on Time-Max (ton):
194 ns

SIJ150DP-T1-GE3 Frequently Asked Questions (FAQs)

The recommended PCB footprint for the SIJ150DP-T1-GE3 is a rectangle with dimensions of 1.5 mm x 0.8 mm, with a 0.3 mm x 0.3 mm pad in the center for the thermal pad.
To ensure reliable soldering, use a soldering iron with a temperature of 260°C to 280°C, and apply a solder paste with a melting point of 217°C to 221°C. Also, make sure to follow the recommended soldering profile and avoid overheating the component.
The maximum operating temperature range for the SIJ150DP-T1-GE3 is -55°C to 150°C, with a maximum junction temperature of 150°C.
The thermal pad of the SIJ150DP-T1-GE3 should be connected to a copper plane on the PCB to ensure efficient heat dissipation. Use a thermal interface material (TIM) with a thermal conductivity of at least 1 W/m-K to fill the gap between the thermal pad and the copper plane.
The recommended storage condition for the SIJ150DP-T1-GE3 is in a dry, cool place with a temperature range of 5°C to 30°C and a relative humidity of 60% or less. Avoid exposing the component to direct sunlight, moisture, or extreme temperatures.

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SIJ150DP-T1-GE3 - Vishay

SIJ150DP-T1-GE3 Details

SIJ150DP-T1-GE3 Frequently Asked Questions (FAQs)

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SIJ150DP-T1-GE3 Overview

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