SIJ482DP-T1-GE3 footprint, schematic symbol and 3D model by Vishay

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PCB Footprints

SIJ482DP-T1-GE3 - Vishay PCB footprint - Other - Other - SIJ482DP-T1-GE3-3

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Datasheet Download Datasheet
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Part Number SIJ482DP-T1-GE3
Manufacturer Vishay
Pin Count 8
Part Category MOSFET (N-Channel)
Package Category Other
Footprint Name Other - SIJ482DP-T1-GE3-3
Released Date Jan 14, 2020
Last Modified Date Mar 7, 2023 4:10 PM UTC
Pinout / Pin List Click Here (Member Only)

SIJ482DP-T1-GE3 Details

Manufacturer Part Number:
SIJ482DP-T1-GE3
Rohs Code:
Yes
Part Life Cycle Code:
Active
ECCN Code:
EAR99
Factory Lead Time:
29 Weeks
Manufacturer:
Vishay Intertechnologies
YTEOL:
6
Configuration:
SINGLE
Drain Current-Max (ID):
60 A
FET Technology:
METAL-OXIDE SEMICONDUCTOR
Number of Elements:
1
Operating Temperature-Max:
150 °C
Polarity/Channel Type:
N-CHANNEL
Power Dissipation-Max (Abs):
69.4 W
Surface Mount:
YES

SIJ482DP-T1-GE3 Frequently Asked Questions (FAQs)

The recommended land pattern for the SIJ482DP-T1-GE3 can be found in the Vishay Intertechnologies' application note 'Land Pattern Recommendations for QFN and DFN Packages' (document number 28353).
The thermal pad on the bottom of the SIJ482DP-T1-GE3 should be connected to a solid ground plane on the PCB to ensure optimal thermal performance. A thermal via array can be used to connect the thermal pad to the ground plane.
The maximum operating temperature range for the SIJ482DP-T1-GE3 is -40°C to 150°C, as specified in the datasheet. However, it's recommended to derate the device's power handling capabilities at higher temperatures to ensure reliable operation.
Yes, the SIJ482DP-T1-GE3 is qualified to AEC-Q101 standards, making it suitable for automotive and high-reliability applications. However, it's essential to consult with Vishay Intertechnologies' application engineers to ensure the device meets the specific requirements of your application.
Follow the recommended soldering profile and guidelines outlined in the Vishay Intertechnologies' application note 'Soldering Guidelines for QFN and DFN Packages' (document number 28354).

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