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SIL05N06A-TP - MCC

Description: N-CHANNEL MOSFET, SOT23-6L

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PCB Footprints
SIL05N06A-TP - MCC PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - SOT23-6L (H=1.45mm)
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3D Models
SIL05N06A-TP - MCC  - 3D model - SOT23 (6-Pin) - SOT23-6L (H=1.45mm)
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SIL05N06A-TP Details

  • Manufacturer Part Number:

    SIL05N06A-TP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    5

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    5 A

  • Drain-source On Resistance-Max:

    0.047 Ω

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Peak Reflow Temperature (Cel):

    260

  • Terminal Finish:

    Matte Tin (Sn)

  • Time@Peak Reflow Temperature-Max (s):

    10

SIL05N06A-TP Frequently Asked Questions (FAQs)

  • The thermal resistance of the SIL05N06A-TP is typically around 2.5°C/W (junction-to-ambient) and 1.5°C/W (junction-to-case). However, this value can vary depending on the specific application and PCB design.
  • Yes, the SIL05N06A-TP is a high-reliability MOSFET designed for use in demanding applications. It has a high MTBF (mean time between failures) and is suitable for use in aerospace, automotive, and industrial applications.
  • The SIL05N06A-TP is designed for low-frequency applications up to 100 kHz. Operating the device at higher frequencies may result in reduced performance and increased power losses.
  • To ensure proper soldering, follow the recommended soldering profile and use a solder with a melting point above 217°C (423°F). Also, make sure the PCB is designed with a suitable thermal pad and clearance to prevent overheating.
  • Yes, the SIL05N06A-TP can be used in a parallel configuration to increase current handling. However, it's essential to ensure that the devices are properly matched and that the PCB is designed to handle the increased current and thermal requirements.

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SIL05N06A-TP Overview

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