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SIL05N06HE3-TP - MCC

Description: Small Signal MOSFETS

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PCB Footprints
SIL05N06HE3-TP - MCC PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - SIL05N06HE3-TP
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3D Models
SIL05N06HE3-TP - MCC  - 3D model - SOT23 (6-Pin) - SIL05N06HE3-TP
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SIL05N06HE3-TP Details

  • Manufacturer Part Number:

    SIL05N06HE3-TP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    5

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    5 A

  • Drain-source On Resistance-Max:

    0.047 Ω

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Peak Reflow Temperature (Cel):

    260

  • Terminal Finish:

    Matte Tin (Sn)

  • Time@Peak Reflow Temperature-Max (s):

    10

SIL05N06HE3-TP Frequently Asked Questions (FAQs)

  • The thermal resistance of the SIL05N06HE3-TP is typically around 2.5°C/W (junction-to-ambient) and 1.5°C/W (junction-to-case). However, this value can vary depending on the specific application and PCB design.
  • Yes, the SIL05N06HE3-TP is a high-reliability MOSFET designed for demanding applications. It has a high MTBF (mean time between failures) and is suitable for use in aerospace, automotive, and industrial applications.
  • To ensure proper soldering, follow the recommended soldering profile and use a solder with a melting point above 217°C. Also, make sure the PCB is designed with a suitable thermal pad and clearance to prevent overheating.
  • The SIL05N06HE3-TP is designed for high-frequency switching applications up to 1 MHz. However, the maximum operating frequency may vary depending on the specific application and PCB design.
  • Yes, the SIL05N06HE3-TP can be used in a parallel configuration to increase the current handling capability. However, it's essential to ensure that the MOSFETs are properly matched and the PCB is designed to handle the increased current and thermal requirements.

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SIL05N06HE3-TP Overview

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