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SIP2100DY-T1-GE3 - Vishay

Description: Motor / Motion / Ignition Controllers & Drivers 5V 1A H-Bridge Motor Driver

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SIP2100DY-T1-GE3 - Vishay PCB footprint - Small Outline Packages - Small Outline Packages - 8-Pin Narrow SOIC
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SIP2100DY-T1-GE3 - Vishay  - 3D model - Small Outline Packages - 8-Pin Narrow SOIC
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SIP2100DY-T1-GE3 Details

  • Manufacturer Part Number:

    SIP2100DY-T1-GE3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOIC-8

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    14 Weeks

  • Date Of Intro:

    2016-06-12

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    5

  • Analog IC - Other Type:

    STEPPER MOTOR CONTROLLER

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max (Isup):

    0.3 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    3.8 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

SIP2100DY-T1-GE3 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the SIP2100DY-T1-GE3 is a rectangular pad with a size of 1.5 mm x 0.8 mm, with a 0.5 mm spacing between pads. It's essential to follow the recommended footprint to ensure proper thermal performance and to prevent thermal runaway.
  • To ensure proper soldering, use a soldering iron with a temperature of 250°C to 270°C. Apply a small amount of solder paste to the PCB pads, and then place the SIP2100DY-T1-GE3 on the pads. Use a gentle pushing motion to ensure the device is properly seated. Finally, use a soldering iron to reflow the solder paste.
  • The maximum operating temperature range for the SIP2100DY-T1-GE3 is -55°C to 150°C. However, it's essential to note that the device's performance and reliability may degrade if operated at extreme temperatures for extended periods.
  • The SIP2100DY-T1-GE3 is not designed for use in high-humidity environments. It's recommended to use the device in environments with a relative humidity of 60% or less. If you must use the device in a high-humidity environment, ensure proper sealing and conformal coating to prevent moisture ingress.
  • The recommended storage condition for the SIP2100DY-T1-GE3 is in a dry, cool place with a temperature range of 20°C to 30°C and a relative humidity of 60% or less. Avoid storing the device in direct sunlight or near heat sources.

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SIP2100DY-T1-GE3 Overview

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