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SIP32103DB-T1-GE1 - Vishay

Description: Power Switch ICs - Power Distribution Bi-Drtn 7A High Enbl Cntrl Load Switch

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PCB Footprints
SIP32103DB-T1-GE1 - Vishay PCB footprint - BGA - BGA - WCSP12 (3 x 4, 0.4 mm pitch, 208 μm bump height, 1.71 mm x 1.31 mm die size)
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3D Models
SIP32103DB-T1-GE1 - Vishay  - 3D model - BGA - WCSP12 (3 x 4, 0.4 mm pitch, 208 μm bump height, 1.71 mm x 1.31 mm die size)
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SIP32103DB-T1-GE1 Details

  • Manufacturer Part Number:

    SIP32103DB-T1-GE1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    WCSP-12

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    7.12

  • Built-in Protections:

    TRANSIENT

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PBGA-B12

  • Length:

    1.71 mm

  • Number of Functions:

    1

  • Number of Terminals:

    12

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current Flow Direction:

    SOURCE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Seated Height-Max:

    0.545 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    2.3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    1.31 mm

SIP32103DB-T1-GE1 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the SIP32103DB-T1-GE1 can be found in the Vishay Intertechnologies' application note AN10343, which provides a detailed layout and land pattern design guide.
  • To ensure reliability in high-temperature applications, it is essential to follow the recommended derating guidelines for the SIP32103DB-T1-GE1, as outlined in the datasheet. Additionally, consider using thermal management techniques, such as heat sinks or thermal interfaces, to maintain a safe operating temperature.
  • The SIP32103DB-T1-GE1 is a sensitive electronic component and requires proper ESD protection and handling precautions. It is recommended to follow standard ESD handling procedures, such as using wrist straps, anti-static bags, and ESD-safe workstations, to prevent damage during handling and assembly.
  • The SIP32103DB-T1-GE1 is an AEC-Q101 qualified device, making it suitable for use in automotive applications. However, it is essential to ensure that the device meets the specific requirements of the automotive system and complies with relevant industry standards.
  • The SIP32103DB-T1-GE1 should be stored in its original packaging, away from direct sunlight, moisture, and extreme temperatures. It is recommended to follow the storage and handling guidelines outlined in the datasheet and to handle the device with clean, dry gloves to prevent contamination.

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SIP32103DB-T1-GE1 Overview

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