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SIP32510DT-T1-GE3 - Vishay

Description: VISHAY - SIP32510DT-T1-GE3 - IC, LOAD SWITCH, 1.1V-5.5V, 3A, TSOT-23

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PCB Footprints
SIP32510DT-T1-GE3 - Vishay PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - SOT-23 : 5- and 6-Lead
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3D Models
SIP32510DT-T1-GE3 - Vishay  - 3D model - SOT23 (6-Pin) - SOT-23 : 5- and 6-Lead
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SIP32510DT-T1-GE3 Details

  • Manufacturer Part Number:

    SIP32510DT-T1-GE3

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Package Description:

    TSOT-23, 6 PIN

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    1

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    LOAD SWITCH

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Length:

    2.975 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSOP

  • Package Equivalence Code:

    TSOP6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.2 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.6125 mm

SIP32510DT-T1-GE3 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the SIP32510DT-T1-GE3 can be found in the Vishay Intertechnologies' application note AN10343, which provides a detailed layout and land pattern design guide.
  • To ensure reliability in high-temperature applications, it is recommended to follow the derating guidelines provided in the datasheet, and to consider using a heat sink or thermal interface material to reduce the junction temperature.
  • The maximum allowed voltage for the SIP32510DT-T1-GE3 is 100V, as specified in the datasheet. Exceeding this voltage may result in device damage or failure.
  • Yes, the SIP32510DT-T1-GE3 is suitable for high-frequency switching applications up to 1 MHz. However, it is recommended to consult the datasheet and application notes for specific guidance on layout, decoupling, and filtering to minimize electromagnetic interference (EMI).
  • The thermal pad of the SIP32510DT-T1-GE3 should be connected to a thermal via or a copper plane on the PCB to ensure effective heat dissipation. It is recommended to use a solder mask-defined thermal pad to prevent solder from flowing onto the thermal pad during reflow.

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SIP32510DT-T1-GE3 Overview

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