Part Image

SiR112DP-T1-RE3 - Vishay

Description: SiR112DP-T1-RE3 N-Channel MOSFET, 133 A, 40 V TrenchFET, 8-Pin SO-8 Vishay Siliconix

Download SiR112DP-T1-RE3 Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
SiR112DP-T1-RE3 - Vishay PCB footprint - Other - Other - PowerPAK SO-8
click to zoom
3D Models
SiR112DP-T1-RE3 - Vishay  - 3D model - Other - PowerPAK SO-8
click to zoom

SiR112DP-T1-RE3 Details

  • Manufacturer Part Number:

    SIR112DP-T1-RE3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOP-8

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    29 Weeks

  • Date Of Intro:

    2018-03-10

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    5.6

  • Avalanche Energy Rating (Eas):

    45 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    40 V

  • Drain Current-Max (ID):

    133 A

  • Drain-source On Resistance-Max:

    0.00196 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    90 pF

  • JESD-30 Code:

    R-PDSO-F5

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    5

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    62.5 W

  • Pulsed Drain Current-Max (IDM):

    200 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    80 ns

  • Turn-on Time-Max (ton):

    90 ns

SiR112DP-T1-RE3 Frequently Asked Questions (FAQs)

  • The recommended storage condition for SIR112DP-T1-RE3 is in a dry, cool place, away from direct sunlight, with a temperature range of -40°C to 125°C and humidity below 60%.
  • While the SIR112DP-T1-RE3 is suitable for high-frequency applications, it's essential to consider the self-resonant frequency (SRF) and ensure the operating frequency is below the SRF to avoid unwanted resonances.
  • To prevent damage, follow the recommended soldering profile: peak temperature 260°C, time above 217°C 30s, and avoid using soldering irons with excessive power.
  • The maximum allowable voltage derating for the SIR112DP-T1-RE3 is 80% of the rated voltage to ensure reliable operation and prevent premature failure.
  • While the SIR112DP-T1-RE3 is rated for high temperatures, it's essential to consider the derating curves and ensure the operating temperature is within the specified range to maintain reliability.

Trust Checks

This model has been provided by an expert contributor.
Expert Contribution
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

SiR112DP-T1-RE3 Overview

Use the download button to access the SiR112DP-T1-RE3 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like SiR11, or try a keyword search, such as Power Field-Effect Transistors

Parts related to SiR112DP-T1-RE3

Showing 0 results