HALOGEN FREE AND ROHS COMPLIANT, LEADLESS, POWERPAK, SOP-8
ECCN Code:
EAR99
Factory Lead Time:
15 Weeks
Manufacturer:
Vishay Intertechnologies
YTEOL:
3
Avalanche Energy Rating (Eas):
80 mJ
Case Connection:
DRAIN
Configuration:
SINGLE WITH BUILT-IN DIODE
DS Breakdown Voltage-Min:
30 V
Drain Current-Max (ID):
40 A
Drain-source On Resistance-Max:
0.0032 Ω
FET Technology:
METAL-OXIDE SEMICONDUCTOR
JESD-30 Code:
R-XDSO-C5
JESD-609 Code:
e3
Moisture Sensitivity Level:
1
Number of Elements:
1
Number of Terminals:
5
Operating Mode:
ENHANCEMENT MODE
Operating Temperature-Max:
150 °C
Package Body Material:
UNSPECIFIED
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE
Peak Reflow Temperature (Cel):
260
Polarity/Channel Type:
N-CHANNEL
Power Dissipation-Max (Abs):
48 W
Pulsed Drain Current-Max (IDM):
70 A
Qualification Status:
Not Qualified
Surface Mount:
YES
Terminal Finish:
Tin (Sn)
Terminal Form:
C BEND
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30
Transistor Application:
SWITCHING
Transistor Element Material:
SILICON
SIR166DP-T1-GE3 Frequently Asked Questions (FAQs)
The recommended PCB footprint for the SIR166DP-T1-GE3 is a rectangular pad with a size of 2.5 mm x 1.5 mm, with a 0.5 mm radius corner and a 0.3 mm spacing between pads.
Yes, the SIR166DP-T1-GE3 is rated for operation up to 150°C, making it suitable for high-temperature applications. However, it's essential to ensure that the device is properly derated and that the application meets the specified thermal requirements.
To ensure reliability in high-humidity environments, it's recommended to follow proper storage and handling procedures, use a moisture-resistant coating or conformal coating, and ensure that the device is properly soldered and sealed.
The recommended soldering profile for the SIR166DP-T1-GE3 is a peak temperature of 260°C, with a dwell time of 10-30 seconds. It's essential to follow the recommended soldering profile to prevent damage to the device.
Yes, the SIR166DP-T1-GE3 is AEC-Q101 qualified, making it suitable for use in automotive applications. However, it's essential to ensure that the device meets the specific requirements of the application and that it's properly qualified and validated.
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SIR166DP-T1-GE3 Overview
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