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SIR180ADP-T1-RE3 - Vishay

Description: N-Channel 60 V 35A (Ta), 137A (Tc) 5.4W (Ta), 83.3W (Tc) Surface Mount PowerPAK® SO-8

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SIR180ADP-T1-RE3 - Vishay PCB footprint - Other - Other - SIR180ADP-T1-RE3-2
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SIR180ADP-T1-RE3 - Vishay  - 3D model - Other - SIR180ADP-T1-RE3-2
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SIR180ADP-T1-RE3 Details

  • Manufacturer Part Number:

    SIR180ADP-T1-RE3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    24 Weeks

  • Date Of Intro:

    2020-05-27

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    5.6

  • Avalanche Energy Rating (Eas):

    80 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    137 A

  • Drain-source On Resistance-Max:

    0.0028 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    34 pF

  • JESD-30 Code:

    R-PDSO-F5

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    5

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    83.3 W

  • Pulsed Drain Current-Max (IDM):

    200 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    74 ns

  • Turn-on Time-Max (ton):

    50 ns

SIR180ADP-T1-RE3 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the SIR180ADP-T1-RE3 is a standard SMD pad layout with a minimum pad size of 2.5 mm x 2.5 mm and a maximum pad size of 3.5 mm x 3.5 mm, with a 1.5 mm spacing between pads.
  • To ensure reliable soldering, use a soldering iron with a temperature range of 250°C to 260°C, and apply a solder paste with a melting point of 217°C to 221°C. Also, ensure the PCB is clean and free of oxidation.
  • The maximum operating temperature range for the SIR180ADP-T1-RE3 is -40°C to 150°C, with a derating of 1.33% per °C above 125°C.
  • Yes, the SIR180ADP-T1-RE3 is designed to withstand high-vibration environments, with a vibration rating of 10 G peak acceleration, 10 Hz to 2000 Hz, and 1 hour duration per axis.
  • The recommended storage condition for the SIR180ADP-T1-RE3 is in a dry, cool place, away from direct sunlight, with a temperature range of 5°C to 30°C and a relative humidity of 40% to 60%.

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SIR180ADP-T1-RE3 Overview

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