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SiR180DP-T1-RE3 - Vishay

Description: VISHAY - SIR180DP-T1-RE3 - MOSFET, N-CH, 60V, 60A, POWERPAK SO

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Symbol
SiR180DP-T1-RE3 - Vishay - PCB symbol
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PCB Footprints
SiR180DP-T1-RE3 - Vishay PCB footprint - Other - Other - PowerPAK® SO-8 Single_1
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3D Models
SiR180DP-T1-RE3 - Vishay - 3D model - Other - PowerPAK® SO-8 Single_1
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SiR180DP-T1-RE3 Details

  • Manufacturer Part Number:

    SIR180DP-T1-RE3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOP-8

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    24 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    5.6

  • Avalanche Energy Rating (Eas):

    80 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    60 A

  • Drain-source On Resistance-Max:

    0.0025 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    40 pF

  • JESD-30 Code:

    R-PDSO-F5

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    5

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    83.3 W

  • Pulsed Drain Current-Max (IDM):

    150 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    76 ns

  • Turn-on Time-Max (ton):

    50 ns

SiR180DP-T1-RE3 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the SIR180DP-T1-RE3 is a rectangular pad with a size of 2.5 mm x 1.5 mm, with a 0.5 mm radius corner and a 0.3 mm spacing between pads.
  • While the SIR180DP-T1-RE3 is rated for operation up to 150°C, it's essential to consider the derating of the component's characteristics at high temperatures. Consult the datasheet and application notes for specific guidance on high-temperature operation.
  • To ensure reliability in humid environments, follow proper storage and handling procedures, and consider applying a conformal coating to the PCB. Additionally, ensure the component is soldered correctly, and the PCB is designed with moisture-resistant materials.
  • The recommended soldering profile for the SIR180DP-T1-RE3 is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. Consult the datasheet and application notes for specific guidance on soldering profiles.
  • While the SIR180DP-T1-RE3 is designed to be robust, it's essential to consider the component's mechanical stress limits and the PCB's design in high-vibration environments. Consult the datasheet and application notes for specific guidance on vibration testing and PCB design.

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SiR180DP-T1-RE3 Overview

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