- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for SIR570DP-T1-RE3
- Part Number SIR570DP-T1-RE3
- Manufacturer Vishay
- Pin Count 11
- Part Category MOSFET (N-Channel)
- Package Category Other
- Footprint Name Other - SIR570DP-T1-RE3-1
- Released Date Nov 24, 2022
- Last Modified Date May 24, 2024 4:52 AM UTC
- Pinout / Pin List Click Here (Member Only)
SIR570DP-T1-RE3 Details
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Manufacturer Part Number:
SIR570DP-T1-RE3
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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ECCN Code:
EAR99
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Factory Lead Time:
16 Weeks
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Date Of Intro:
2020-09-02
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Manufacturer:
Vishay Intertechnologies
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YTEOL:
6.2
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Avalanche Energy Rating (Eas):
45 mJ
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Case Connection:
DRAIN
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Configuration:
SINGLE WITH BUILT-IN DIODE
SIR570DP-T1-RE3 Frequently Asked Questions (FAQs)
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The recommended PCB footprint for the SIR570DP-T1-RE3 is a rectangle with dimensions of 2.5 mm x 1.3 mm, with a 0.5 mm radius corner. The pad spacing is 0.65 mm, and the pad size is 1.1 mm x 0.5 mm.
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To handle thermal management, ensure good thermal conductivity between the device and the PCB by using a thermal pad or thermal interface material. Keep the surrounding components at a safe distance to prevent thermal coupling. A heat sink or thermal vias can also be used to dissipate heat.
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The maximum operating temperature range for the SIR570DP-T1-RE3 is -55°C to 150°C. However, the device's performance and reliability may degrade if operated at the extreme ends of this range for extended periods.
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Yes, the SIR570DP-T1-RE3 is designed to withstand vibrations up to 10 G peak acceleration. However, it's essential to ensure proper PCB mounting and secure the device to prevent mechanical stress and damage.
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To prevent EOS, ensure that the device is operated within the recommended voltage and current ratings. Use proper PCB layout and routing to minimize electromagnetic interference (EMI) and radio-frequency interference (RFI). Implement overvoltage protection and surge protection devices if necessary.
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SIR570DP-T1-RE3 Overview
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