- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for SIR572DP-T1-RE3
- Part Number SIR572DP-T1-RE3
- Manufacturer Vishay
- Pin Count 11
- Part Category MOSFET (N-Channel)
- Package Category Other
- Footprint Name Other - PowerPAK SO-8 Single
- Released Date Feb 25, 2024
- Last Modified Date Nov 19, 2025 4:32 AM UTC
- Pinout / Pin List Click Here (Member Only)
SIR572DP-T1-RE3 Details
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Manufacturer Part Number:
SIR572DP-T1-RE3
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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Package Description:
SOP-8
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ECCN Code:
EAR99
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Factory Lead Time:
29 Weeks
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Manufacturer:
Vishay Intertechnologies
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YTEOL:
6.12
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Avalanche Energy Rating (Eas):
20 mJ
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Case Connection:
DRAIN
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Configuration:
SINGLE WITH BUILT-IN DIODE
SIR572DP-T1-RE3 Frequently Asked Questions (FAQs)
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The recommended PCB footprint for the SIR572DP-T1-RE3 is a 5-pin TO-252 package with a recommended land pattern of 3.3mm x 2.5mm. It's essential to follow the recommended footprint to ensure proper thermal performance and to prevent thermal runaway.
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To ensure proper soldering, use a soldering iron with a temperature of 250°C to 260°C. Apply a small amount of solder paste to the PCB pads, and then place the component on the board. Use a reflow oven or a hot air gun to solder the component. Make sure to follow the recommended soldering profile and avoid overheating the component.
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The maximum allowed voltage transient for the SIR572DP-T1-RE3 is 80V. Exceeding this voltage may cause damage to the component or affect its reliability. It's essential to ensure that the voltage transients in the application do not exceed this limit.
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The SIR572DP-T1-RE3 is rated for operation up to 150°C. However, it's essential to derate the component's power dissipation and ensure proper heat sinking to prevent thermal runaway. Consult the datasheet and application notes for more information on high-temperature operation.
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To calculate the power dissipation, you need to know the voltage drop across the component, the current flowing through it, and the thermal resistance of the component and the PCB. Use the formula Pd = (Vin - Vout) x Iout, where Pd is the power dissipation, Vin is the input voltage, Vout is the output voltage, and Iout is the output current. Consult the datasheet and application notes for more information on power dissipation calculation.
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SIR572DP-T1-RE3 Overview
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