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- Stock & Prices $ Price & Stock for SIR626ADP-T1-RE3
- Part Number SIR626ADP-T1-RE3
- Manufacturer Vishay
- Pin Count 11
- Part Category MOSFET (N-Channel)
- Package Category Other
- Footprint Name Other - PowerPAK SO-8_2021_1
- Released Date Sep 3, 2021
- Last Modified Date Mar 7, 2023 4:10 PM UTC
- Pinout / Pin List Click Here (Member Only)
SIR626ADP-T1-RE3 Details
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Manufacturer Part Number:
SIR626ADP-T1-RE3
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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ECCN Code:
EAR99
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Factory Lead Time:
24 Weeks
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Manufacturer:
Vishay Intertechnologies
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YTEOL:
5.6
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Avalanche Energy Rating (Eas):
125 mJ
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Case Connection:
DRAIN
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Configuration:
SINGLE WITH BUILT-IN DIODE
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DS Breakdown Voltage-Min:
60 V
SIR626ADP-T1-RE3 Frequently Asked Questions (FAQs)
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The recommended PCB footprint for the SIR626ADP-T1-RE3 is a standard SOD-923 package with a 1.2mm x 0.8mm pad size and a 0.5mm spacing between pads. It's essential to follow the recommended footprint to ensure proper thermal performance and to prevent overheating.
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While the SIR626ADP-T1-RE3 has a high junction temperature rating of 150°C, it's essential to consider the derating curves and thermal resistance to ensure the device operates within a safe temperature range. It's recommended to perform thermal analysis and simulation to ensure the device can handle the expected operating temperatures.
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To ensure proper soldering, follow the recommended soldering profile, which includes a peak temperature of 260°C and a dwell time of 10-30 seconds. It's also essential to use a solder with a high melting point, such as SAC305, and to ensure the PCB is clean and free of oxidation.
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The recommended storage condition for the SIR626ADP-T1-RE3 is in a dry, cool place with a temperature range of 5°C to 30°C and a relative humidity of 60% or less. It's essential to store the devices in their original packaging or in a sealed bag to prevent moisture absorption.
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While the SIR626ADP-T1-RE3 is a robust device, it's essential to consider the vibration specifications and ensure the device is properly mounted and secured to the PCB. It's recommended to perform vibration testing and simulation to ensure the device can handle the expected vibration levels.
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SIR626ADP-T1-RE3 Overview
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