SIR626LDP-T1-RE3 footprint, schematic symbol and 3D model by Vishay

Symbol

click to zoom

PCB Footprints

SIR626LDP-T1-RE3 - Vishay PCB footprint - Other - Other - PowerPAK® SO-8 Single_1

click to zoom

3D Models

SIR626LDP-T1-RE3 - Vishay - 3D model - Other - PowerPAK® SO-8 Single_1

click to zoom

Datasheet Download Datasheet
Stock & Prices Price & Stock for SIR626LDP-T1-RE3
Part Number SIR626LDP-T1-RE3
Manufacturer Vishay
Pin Count 8
Part Category MOSFET (N-Channel)
Package Category Other
Footprint Name Other - PowerPAK® SO-8 Single_1
Released Date Apr 2, 2019
Last Modified Date Mar 7, 2023 4:10 PM UTC
Pinout / Pin List Click Here (Member Only)

SIR626LDP-T1-RE3 Details

Manufacturer Part Number:
SIR626LDP-T1-RE3
Rohs Code:
Yes
Part Life Cycle Code:
Active
ECCN Code:
EAR99
Factory Lead Time:
24 Weeks
Date Of Intro:
2018-09-17
Manufacturer:
Vishay Intertechnologies
YTEOL:
5.6
Avalanche Energy Rating (Eas):
125 mJ
Case Connection:
DRAIN
Configuration:
SINGLE WITH BUILT-IN DIODE
DS Breakdown Voltage-Min:
60 V
Drain Current-Max (ID):
186 A
Drain-source On Resistance-Max:
0.0021 Ω
FET Technology:
METAL-OXIDE SEMICONDUCTOR
Feedback Cap-Max (Crss):
60 pF
JESD-30 Code:
R-PDSO-F5
JESD-609 Code:
e3
Moisture Sensitivity Level:
1
Number of Elements:
1
Number of Terminals:
5
Operating Mode:
ENHANCEMENT MODE
Operating Temperature-Max:
150 °C
Operating Temperature-Min:
-55 °C
Package Body Material:
PLASTIC/EPOXY
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE
Peak Reflow Temperature (Cel):
260
Polarity/Channel Type:
N-CHANNEL
Power Dissipation-Max (Abs):
104 W
Pulsed Drain Current-Max (IDM):
400 A
Surface Mount:
YES
Terminal Finish:
Tin (Sn)
Terminal Form:
FLAT
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30
Transistor Application:
SWITCHING
Transistor Element Material:
SILICON
Turn-off Time-Max (toff):
110 ns
Turn-on Time-Max (ton):
162 ns

SIR626LDP-T1-RE3 Frequently Asked Questions (FAQs)

The recommended land pattern for the SIR626LDP-T1-RE3 can be found in the Vishay Intertechnologies' application note 'Land Pattern Recommendations for Vishay's SIR626LDP-T1-RE3' or by contacting Vishay's technical support team.
To ensure reliability in high-temperature applications, follow the recommended derating guidelines in the datasheet, and consider using a thermal interface material to improve heat dissipation. Additionally, ensure proper PCB design and layout to minimize thermal resistance.
The maximum allowable voltage stress for the SIR626LDP-T1-RE3 is specified in the datasheet as 80% of the rated voltage. However, it's recommended to consult with Vishay's technical support team for specific application requirements.
Yes, the SIR626LDP-T1-RE3 is suitable for high-frequency switching applications. However, it's essential to consider the device's switching characteristics, such as rise and fall times, and ensure proper PCB design and layout to minimize parasitic inductance and capacitance.
The thermal pad of the SIR626LDP-T1-RE3 should be connected to a thermal relief pattern on the PCB to ensure efficient heat dissipation. Consult the datasheet and application notes for specific guidelines on thermal pad connection and PCB design.

Trust Checks

Expert Contribution

System Verified

Community Approved

SIR626LDP-T1-RE3 Overview

Use the download button to access the SIR626LDP-T1-RE3 schematic symbol, PCB footprint, and 3D model.

To find more CAD model downloads similar to this part, try a partial part number search, like SIR62, or try a keyword search, such as Power Field-Effect Transistors

Parts related to SIR626LDP-T1-RE3

Showing 0 results


Please enter a minimum 3 letters or numbers
← Prev Next →

SIR626LDP-T1-RE3 - Vishay

SIR626LDP-T1-RE3 Details

SIR626LDP-T1-RE3 Frequently Asked Questions (FAQs)

Trust Checks

SIR626LDP-T1-RE3 Overview

Parts related to SIR626LDP-T1-RE3