SIR690DP-T1-GE3 footprint, schematic symbol and 3D model by Vishay

Symbol

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PCB Footprints

SIR690DP-T1-GE3 - Vishay PCB footprint - Other - Other - PowerPAK® SO-8 Single_1

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3D Models

SIR690DP-T1-GE3 - Vishay - 3D model - Other - PowerPAK® SO-8 Single_1

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Datasheet Download Datasheet
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Part Number SIR690DP-T1-GE3
Manufacturer Vishay
Pin Count 11
Part Category MOSFET (N-Channel)
Package Category Other
Footprint Name Other - PowerPAK® SO-8 Single_1
Released Date Aug 20, 2020
Last Modified Date Mar 7, 2023 4:10 PM UTC
Pinout / Pin List Click Here (Member Only)

SIR690DP-T1-GE3 Details

Manufacturer Part Number:
SIR690DP-T1-GE3
Rohs Code:
Yes
Part Life Cycle Code:
Active
ECCN Code:
EAR99
Factory Lead Time:
29 Weeks
Date Of Intro:
2016-09-25
Manufacturer:
Vishay Intertechnologies
YTEOL:
6.12
Avalanche Energy Rating (Eas):
45 mJ
Case Connection:
DRAIN
Configuration:
SINGLE WITH BUILT-IN DIODE
DS Breakdown Voltage-Min:
200 V
Drain Current-Max (ID):
34.4 A
Drain-source On Resistance-Max:
0.035 Ω
FET Technology:
METAL-OXIDE SEMICONDUCTOR
Feedback Cap-Max (Crss):
10.5 pF
JESD-30 Code:
R-PDSO-F5
JESD-609 Code:
e3
Moisture Sensitivity Level:
1
Number of Elements:
1
Number of Terminals:
5
Operating Mode:
ENHANCEMENT MODE
Operating Temperature-Max:
150 °C
Operating Temperature-Min:
-55 °C
Package Body Material:
PLASTIC/EPOXY
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE
Peak Reflow Temperature (Cel):
260
Polarity/Channel Type:
N-CHANNEL
Power Dissipation-Max (Abs):
104 W
Pulsed Drain Current-Max (IDM):
80 A
Surface Mount:
YES
Terminal Finish:
Matte Tin (Sn)
Terminal Form:
FLAT
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30
Transistor Application:
SWITCHING
Transistor Element Material:
SILICON
Turn-off Time-Max (toff):
50 ns
Turn-on Time-Max (ton):
58 ns

SIR690DP-T1-GE3 Frequently Asked Questions (FAQs)

The recommended PCB footprint for the SIR690DP-T1-GE3 is a pad size of 5.5 mm x 4.5 mm with a 1.5 mm x 1.5 mm thermal pad. It's essential to follow the recommended footprint to ensure proper thermal performance and to prevent overheating.
To ensure proper soldering, use a soldering iron with a temperature of 250°C to 260°C. Apply a small amount of solder paste to the PCB pads, and then place the SIR690DP-T1-GE3 on the PCB. Use a reflow oven or a hot air gun to solder the component. Make sure to follow the recommended soldering profile to prevent damage to the component.
The maximum operating temperature range for the SIR690DP-T1-GE3 is -55°C to 175°C. However, it's essential to note that the component's performance and reliability may degrade if operated at the extreme ends of this temperature range.
The SIR690DP-T1-GE3 is not hermetically sealed, so it's not recommended for use in high-humidity environments. However, if you must use it in such an environment, ensure that the component is properly sealed or coated to prevent moisture ingress.
The recommended storage condition for the SIR690DP-T1-GE3 is in a dry, cool place with a temperature range of 20°C to 30°C and humidity below 60%. Avoid storing the component in direct sunlight or near heat sources.

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SIR690DP-T1-GE3 Overview

Use the download button to access the SIR690DP-T1-GE3 schematic symbol, PCB footprint, and 3D model.

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SIR690DP-T1-GE3 - Vishay

SIR690DP-T1-GE3 Details

SIR690DP-T1-GE3 Frequently Asked Questions (FAQs)

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