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SIR692DP-T1-RE3 - Vishay

Description: Vishay SIR692DP-T1-RE3 N-channel MOSFET, 24.2 A, 250 V, 8-Pin SO

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SIR692DP-T1-RE3 - Vishay PCB footprint - Other - Other - PowerPAK SO-8 Single_2022
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SIR692DP-T1-RE3 - Vishay  - 3D model - Other - PowerPAK SO-8 Single_2022
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SIR692DP-T1-RE3 Details

  • Manufacturer Part Number:

    SIR692DP-T1-RE3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOP-8

  • ECCN Code:

    EAR99

  • Date Of Intro:

    2017-03-22

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    6

  • Avalanche Energy Rating (Eas):

    11.25 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    250 V

  • Drain Current-Max (ID):

    24.2 A

  • Drain-source On Resistance-Max:

    0.067 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    9.3 pF

  • JESD-30 Code:

    R-PDSO-F5

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    5

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    104 W

  • Pulsed Drain Current-Max (IDM):

    50 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    92 ns

  • Turn-on Time-Max (ton):

    78 ns

SIR692DP-T1-RE3 Frequently Asked Questions (FAQs)

  • The recommended land pattern for SIR692DP-T1-RE3 can be found in the Vishay Intertechnologies' application note 'Land Pattern Recommendations for Vishay's Power MOSFETs' (document number: 41551).
  • To ensure reliability in high-temperature applications, it's essential to follow the recommended derating guidelines for the SIR692DP-T1-RE3. Additionally, consider using a thermal interface material (TIM) to improve heat transfer between the device and the heat sink.
  • To prevent electrostatic discharge (ESD) damage, handle the SIR692DP-T1-RE3 in an ESD-protected environment, wear an ESD wrist strap or use an ESD mat, and avoid touching the device's pins or leads.
  • Yes, the SIR692DP-T1-RE3 can be used in a parallel configuration to increase current handling. However, it's crucial to ensure that the devices are properly matched, and the layout is designed to minimize current imbalance and thermal mismatch.
  • The recommended gate drive circuits for the SIR692DP-T1-RE3 can be found in the Vishay Intertechnologies' application note 'Gate Drive Circuits for Power MOSFETs' (document number: 41552).

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