- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for SIR800DP-T1-GE3
- Part Number SIR800DP-T1-GE3
- Manufacturer Vishay
- Pin Count 9
- Part Category MOSFET (N-Channel)
- Package Category Other
- Footprint Name Other - PowerPAK® SO-8 Single_2
- Released Date May 22, 2021
- Last Modified Date Mar 7, 2023 4:10 PM UTC
- Pinout / Pin List Click Here (Member Only)
SIR800DP-T1-GE3 Details
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Manufacturer Part Number:
SIR800DP-T1-GE3
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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Package Description:
HALOGEN FREE AND ROHS COMPLIANT, POWERPAK, SOP-8
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ECCN Code:
EAR99
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Factory Lead Time:
15 Weeks
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Manufacturer:
Vishay Intertechnologies
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YTEOL:
5.3
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Avalanche Energy Rating (Eas):
45 mJ
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Case Connection:
DRAIN
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Configuration:
SINGLE WITH BUILT-IN DIODE
SIR800DP-T1-GE3 Frequently Asked Questions (FAQs)
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The recommended PCB footprint for the SIR800DP-T1-GE3 is a pad size of 2.5 mm x 2.5 mm with a 1.5 mm x 1.5 mm thermal pad. It's essential to follow the recommended footprint to ensure proper thermal performance and to prevent overheating.
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To ensure proper soldering, use a soldering iron with a temperature of 250°C to 260°C. Apply a small amount of solder paste to the PCB pads, and then place the component. Use a reflow oven or a hot air gun to solder the component. Avoid overheating, as it can damage the component.
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The maximum operating temperature range for the SIR800DP-T1-GE3 is -55°C to 150°C. However, it's recommended to operate the device within a temperature range of -40°C to 125°C for optimal performance and reliability.
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The SIR800DP-T1-GE3 is not hermetically sealed, so it's not recommended for use in high-humidity environments. However, if you must use it in such an environment, ensure the device is properly sealed or coated to prevent moisture ingress.
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Store the SIR800DP-T1-GE3 in a dry, cool place with a temperature range of 20°C to 30°C and humidity below 60%. Avoid exposing the device to direct sunlight, moisture, or extreme temperatures.
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SIR800DP-T1-GE3 Overview
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